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Unimicron, Kinsus to expand additional ABF substrate capacities

Jay Liu, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 5 June 2019 0

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand for AI-related applications.

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