Molding compounds to see worst crunch among packaging materials in 2022

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 24 December 2021 0

Credit: DIGITIMES

Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die attach film) to be in less tight supply, according to industry sourc...

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