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Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia Wednesday 29 December 2021 0

Credit: DIGITIMES

IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better explore heterogeneous integration business opportunities.

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