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Samsung Electro-Mechanics reportedly joins Broadcom supply chain amid AI chip surge

Nexperia chip disruption forces Honda and Nissan to cut production in Japan and overseas; Toyota unaffected

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ODMs slash non-China manufacturing targets to 40% as tariff eases

Arm highlights AI efficiency advantage amid data center power constraints

Advantech says tight DDR4 supply and rising SSD prices squeeze industrial PC margins

Tech war embroiled Taiwan sees fragile truce in Trump-Xi summit

ASML reframes its China strategy with advanced packaging debut of TWINSCAN XT:260

Cambricon's NeuWare breaks China's dependence on Nvidia CUDA

Arm surges past US$1.1 billion for third consecutive quarter on AI and cloud demand

IC designers race to win orders despite declining margins

Inventec notebook shipments fall 15.79% in October amid seasonal slowdown

Euro tier 1 and Japan supplier sounds alarms over Nexperia chip crisis

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Revival of US and South Korea shipbuilding offers market entry for Taiwan

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Home Research Research insights

Samsung creates advanced packaging department; Chinese makers keen on building 8.6G panel line; Huawei AITO M7 electric SUV unveiled

Tom Lo, DIGITIMES Research, Taipei Thursday 14 July 2022 0

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