中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
FOPLP progress fastest in foundries, slower in testing and panel fabs
Tomorrow's Headlines
9h 38min ago
YMTC launched third phase with hubei state capital support, no big fund stake
Tomorrow's Headlines
9h 38min ago
Military and semiconductor sectors boost IPC growth momentum
Tomorrow's Headlines
9h 39min ago
AI chip demand drives future semiconductor growth trends
Tomorrow's Headlines
9h 39min ago
YMTC decade-long journey highlights the evolution of China tech sovereignty
Tomorrow's Headlines
9h 39min ago
China's leading wafer maker aquaire three loss-making subsidiaries to strengthen 12-inch wafer integration
Tomorrow's Headlines
9h 39min ago
Home
Research
Research insights
US CHIPS and Science Act to go online; Kioxia 162-layer 3D NAND flash to begin volume production; Baidu unmanned vehicle enters mass production
Tom Lo, DIGITIMES Research, Taipei
Friday 5 August 2022
0
The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please
sign in
if you wish to continue.
Introduction
Related stories
AV vehicle costs to continue declining as supply chain localizes, says Baidu
Baidu to integrate AIGC into its app, cloud and search services
VW to establish JV with China-based Horizon Robotics for autonomous driving push
Suppliers set to enter production race for 3D NAND with 200+ layers
Panasonic to increase EV battery production for Tesla
Kioxia sees datacenter clients adjust NAND inventory
Chips Act signed into law but tough challenges ahead
US Senate renews EV tax credit while many models likely not eligible
Chinese smartphone brands see declines in 2Q22, says DIGITIMES Research
Show more
Tags
3D
Asia enterprises
Baidu
flash
Kioxia
NAND
NAND flash
online
USA
vehicle
Share this article
Other links
Print
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
MOST-READ
7 DAYS NEWS
TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's first open AI computing architecture: Sugon, Lenovo, Moore Threads come together to challenge Nvidia CUDA
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
Samsung's Exynos comeback aims for Qualcomm's mobile chip dominance
CATL procurement staff visits South Korea, reportedly seeking key equipment and manufacturing technologies
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
Full list
Join our mailing list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first
