TSMC to build new CoWoS capacity in central Taiwan

Monica Chen, Hsinchu; Willis Ke, DIGITIMES Asia Monday 26 June 2023 0

Credit: DIGITIMES

TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand for AI GPU and other HPC (high performance computing) chips, driven...

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