Here are the most-read stories during the week of October 16-20:
Chongqing rises to be power semiconductor hub
Avatar 12, an EV developed by Huawei, CATL, and Changan Automobile, has been rolled off the production line in Chongqing, China. Huawei plans to deepen ties with carmakers with Chongqing's advantages of location and complete automotive supply chain. The city is also rising to be a new hub of power semiconductor segment.
Foldable iPad in intensive development; mass production to begin in 2H24 at the earliest
Supply chain sources reported that Apple is working with suppliers to develop a foldable iPad, and small-scale production could begin as early as the end of 2024. This suggests that Apple may be announcing this product in late 2024 or early 2025. Analyses stated that the iPad will be Apple's entry point into foldable designs, and the next step will be a foldable iPhone.
Huawei scores big as Chinese telcos boost its tech arsenal with smartphone and AI server orders
In a strategic move that underscores Huawei's expanding influence on the Chinese market, the tech giant is set to supply China Mobile with 1.2 million units of its latest smartphone, the Mate 60, as reported by Chinese media. The order, if estimated through Huawei's Mate 60 (12GB+256GB) at a retail price of CNY5,499 (US$751), amounts to approximately CNY6.6 billion (US$900 million).
TSMC founder Morris Chang sounds alarm on shrinking competitiveness amid eroding globalization
TSMC founder Morris Chang cautioned that TSMC's edge in the semiconductor industry may erode due to geopolitical and economic challenges. He believes Japan is expected to stand out in the global semiconductor manufacturing ecosystem. Chang said that the prevailing emphasis on national security had eroded globalization and free trade within the semiconductor industry, elevating TSMC's significance for countries, adding that some competitors are trying to seize the opportunity to outdo TSMC.
Huawei starts preparing P70 smartphone mass production for 2024 launch
The Mate 60 series' great commercial success in China has given Huawei a boost in confidence with various media reporting that the Chinese brand is already stockpiling components and preparing for the mass production of its next generation of smartphones, codenamed "P70", scheduled to be launched in 2024. Huawei has reportedly decided on its supply chain partners to produce this 2024 flagship product, including the in-display fingerprint scanning module manufacturers. But it has kept the information about its system-on-chip (SoC) as a top secret. It is unclear whether the P70 will also use the Kirin 9000S from the Mate 60 Pro, or a more advanced SoC.
Micron opens new assembly and test facility in Malaysia
Micron Technology recently commemorated its 45th anniversary with the inauguration of its state-of-the-art assembly and testing facility in Batu Kawan, Penang, Micron has already allocated US$1 billion towards the construction and full equipping of this new facility in Penang. Over the next few years, the US memory chipmaker plans to invest an additional US$1 billion to expand factory space to a total of 1.5 million square feet.
Breaching the tech blockade: Chinese MCU firms employ the RISC-V chip architecture
Amidst the ongoing US and China tech rivalry, Chinese microcontroller (MCU) companies are actively developing MCUs with the RISC-V architecture to break through the technology sanctions. The MCU ecosystem is dominated by the proprietary Arm architecture developed by Arm Holdings, but efforts by the Chinese firms are bearing fruit.
