US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts

Judy Lin, DIGITIMES Asia, Taipei

Jul 10, 2024, 10:45 0

Credit: AFP

On July 9, the US Department of Commerce issued a Notice of Intent (NOI) to launch a competition for new research and development (R&D) activities aimed at establishing and accelerating domestic capacity for semiconductor advanced packaging. The CHIPS for...

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