CONNECT WITH US

Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots

Janet Kang, Taipei; Levi Li, DIGITIMES Asia 0

Credit: DIGITIMES

AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face mounting pressure to pivot and compete effectively. This underscores...

The article requires paid subscription. Subscribe Now