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SK Hynix taps VP to lead US HBM packaging facility

Daniel Chiang, Taipei; Levi Li, DIGITIMES Asia 0

SK Hynix VP William Lee. Credit: SK Hynix

SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition.

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