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Towa's HBM4 packaging breakthrough powers ambitious growth plan

Chiang, Jen-Chieh, Taipei; Sherri Wang, DIGITIMES Asia Wednesday 2 April 2025 0

Credit: Towa

Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company...

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