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Innolux CEO responds to FOPLP delays

Rebecca Kuo, Taipei; Levi Li, DIGITIMES Asia Thursday 17 April 2025 0

Innolux Chairman and CEO, Jim Hung. Credit: DIGITIMES

Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning itself as a serious contender, skeptics question whether the display...

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