CONNECT WITH US

IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec

Jingyue Hsiao, DIGITIMES Asia, Taipei 0

Credit: AFP

According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging plant in Bromont, Quebec. Under the deal, IBM will establish a high-volume...

The article requires paid subscription. Subscribe Now