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Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk

Flora Wang, Taipei; Levi Li, DIGITIMES Asia 0

Credit: DIGITIMES

Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan's...

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