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Hanwha Semitech advances fluxless bonding to address HBM packaging strains

Daniel Chiang, Seoul; Sherri Wang, DIGITIMES Asia 0

Credit: DIGITIMES

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools,...

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