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Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026

Lillian Chen, Taipei; Charlene Chen, DIGITIMES Asia Friday 7 November 2025 0

Credit: Hanmi

Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources expect this equipment to be officially adopted starting...

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