News tagged Hanmi at DIGITIMES

NEWS TAGGED HANMI

Monday 15 December 2025

SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations...

Friday 7 November 2025

Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026

Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...

Thursday 30 October 2025

Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute

Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM...

Wednesday 29 October 2025

Hanmi eyes AI chip packaging amid HBM market challenges

Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...

Monday 27 October 2025

Samsung and Hanmi thaw ties at SEDEX, eye HBM4 collaboration

Longtime rivals Samsung Electronics and Hanmi Semiconductor may be wiping the slate clean and possibly teaming up after South Korea's 27^th Semiconductor Exhibition (SEDEX...

Wednesday 8 October 2025

LG accelerates hybrid bonding development to challenge Hanmi and Hanwha

LG Electronics is accelerating its deployment in the HBM equipment business after reportedly investing in hybrid bonding development. With Hanmi Semiconductor dominating the market...

Tuesday 7 October 2025

Weekly news roundup: Intel and TSMC pour billions into Arizona; Memory chip prices soar, Hanmi expands to Singapore to support Micron

Below are the most-read DIGITIMES Asia stories from the week of September 29–October 5.

Friday 3 October 2025

Hanmi Semiconductor expands to Singapore to support Micron's HBM production

Hanmi Semiconductor has established a local entity in Singapore to provide on-site support for its core customer, Micron. According to Korean media reports, including Financial...

Sunday 28 September 2025

Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem...

Saturday 13 September 2025

SK Hynix's rumored slowing TCB investment raises concerns for Hanmi Semiconductor as bonders market expands

SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...

Friday 12 September 2025

SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment

The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...

Thursday 28 August 2025

South Korea races to close gap in hybrid bonding as global rivals move ahead

South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...

Tuesday 19 August 2025

SK Hynix signals slowing demand for TCB equipment, putting Hanmi at risk

The market for thermo-compression bonders, or TCB, has surged on the back of booming demand for AI. But signals out of South Korea now show signs of a slowdown. New orders in the...

Monday 4 August 2025

Hanmi confident in securing all HBM4 equipment orders as half of 1H25 sales go to Taiwan

Benefiting from the development of the high-bandwidth memory (HBM) market, Hanmi Semiconductor's second quarter 2025 performance continues to hit new highs, with overseas markets...

Thursday 31 July 2025

Hanmi reportedly planning US$71 million hybrid bonding investment amid HBM surge

South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by...

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Dec 24, 08:00

InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups

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