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NEWS TAGGED HANMI
Wednesday 23 April 2025
Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
Tuesday 22 April 2025
Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
Friday 18 April 2025
Micron challenges South Korean dominance in HBM market amid tariff protectionism
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current...
Friday 18 April 2025
SK Hynix-Hanmi alliance fractures as Korean memory giant seeks new suppliers
SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha...
Friday 18 April 2025
Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance
Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South...
Wednesday 2 April 2025
Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
Monday 7 October 2024
SK Hynix diversifies supply chain, challenges Hanmi's grip on HBM equipment
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Thursday 23 May 2024
Hanmi Semiconductor expands further after securing Micron, SK Hynix orders
Hanmi Semiconductor's new plant has been operational for just over a month, and the company has started expanding further. They aim to accelerate the production capacity of High-Bandwidth...
Monday 15 April 2024
Hanmi won HBM equipment orders from Micron, Samsung next?
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Monday 19 February 2024
South Korean chip tool makers voice apprehension over SIA's lobby to expand export ban
The Semiconductor Industry Association (SIA) is said to be lobbying the Biden Administration to require semiconductor equipment suppliers in allies, including Japan and South Korea,...
Tuesday 2 January 2024
Hanmi Semiconductor in exclusive talks with Samsung for HBM process equipment supply
With the emergence of AI, the demand for High Bandwidth Memory (HBM) has surged, casting a spotlight on its intricate supply chain.
Thursday 31 August 2023
South Korean equipment makers keen on developing new-gen HBM processing tools
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
Friday 11 August 2023
Hanmi Semiconductor established new production site to prepare for TSV process orders in HBM
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...