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NEWS TAGGED 2026
Friday 27 September 2024
Semco utilizes MLCC experience to develop world's first mini solid-state battery
Semco has developed the world's first "mini oxide-based solid-state battery" capable of being integrated into wearable devices. The company is reportedly conducting product tests...
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Thursday 19 September 2024
Glass substrate technology gains traction for advanced packaging by 2026
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
Monday 16 September 2024
Tata plans to build two more fabs in India
As Tata Electronics constructs India's first commercial wafer fab in three decades, it plans to leverage this experience to develop additional fabs in the medium to long term. The...
Monday 16 September 2024
Samsung secures new automotive customer for its 2nm process; expects mass production in late 2026
Samsung has secured US-based imaging chip company Ambarella as a customer for its 2nm process. Samsung will produce Ambarella's advanced driving assistance system (ADAS) chips, with...
Friday 13 September 2024
Samsung to reportedly phase out LED biz due to Chinese price pressure
According to South Korean media Newsway, Samsung's Device Solutions (DS) division plans to phase out LED lighting production at its Giheung campus by 2030. Most employees...
Monday 9 September 2024
High-NA EUV adoption hampered by cost, mass-production on track for 2026
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
Friday 6 September 2024
BOE reportedly seeks to mass-produce glass substrates for semiconductor packaging in 2026
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Monday 2 September 2024
Samsung continues to push back construction on P4 and P5 to focus on Taylor site
Previously, Samsung Electronics reportedly decided to suspend the construction of its Phase 2 wafer foundry production line at the Pyeongtaek P4 fab.
Monday 26 August 2024
Evalue set to lead Taiwan EV charging market with over 30% share by 2026
Fortune Electric's subsidiary, Evalue, is set to expand its charging pile network across Taiwan, aiming to install 3,700 units by the end of 2026, which could secure over 30% of the...
Monday 19 August 2024
Intel's 18A under fire: struggling yields, skepticism, and a race against TSMC
Intel has been attempting to shift the narrative to a more positive light following the company's "gruesome" series of trainwrecks that saw a disappointing second-quarter 2024 earnings...
Friday 16 August 2024
Apple reportedly developing large foldable devices, exploring the possibility of a foldable iPad
Rumors indicate that Apple is developing a foldable iPhone, with speculation about a larger device that could be a hybrid between a Mac and an iPad. Recent reports suggest that Apple's...
Monday 12 August 2024
Non-a-Si panels to gain prominence in automotive displays throughout 2024-2029, according to DIGITIMES Research
Global automotive display shipments are estimated to reach 225 million units in 2024, up 7.8% from a year ago, according to Jason Yang, DIGITIMES Research analyst specializing...
Tuesday 6 August 2024
AI data center chip demand to slow beyond 2026, says Omdia
The current hypergrowth in GPUs and other accelerator chips for AI in the cloud and the data center will eventually decelerate but not until it has transformed the industry, according...
Friday 2 August 2024
Intel announces cost reduction plan, expects to reduce tile production outsourcing to TSMC in 2026
Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...
Next-Gen Retail Revolution: The Power of Edge AI and Cloud Surveillance
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research