Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
The drop of Taiwan's solar field development volume in 2024 has sent ripples into AUO's expected installation volume of 2025 and 2026. However such outlook did not stop the firm's...
Taiwan's manufacturing sector reduced greenhouse gas emissions by 6.62% in 2022, surpassing the national average. While progress has been made, further reductions require significant...
Fred Yeh, president of solar system manufacturer Motech, stated on October 3 that demand for solar products is rising due to net-zero building requirements, and Motech has begun making...
Taiwan is set to introduce a carbon fee in 2025, targeting approximately 500 companies with rates between NT$300 (approx. US$9.30) and NT$500 per metric ton. However, the final fee...
Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on...
Semco has developed the world's first "mini oxide-based solid-state battery" capable of being integrated into wearable devices. The company is reportedly conducting product tests...
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
As Tata Electronics constructs India's first commercial wafer fab in three decades, it plans to leverage this experience to develop additional fabs in the medium to long term. The...
Samsung has secured US-based imaging chip company Ambarella as a customer for its 2nm process. Samsung will produce Ambarella's advanced driving assistance system (ADAS) chips, with...
According to South Korean media Newsway, Samsung's Device Solutions (DS) division plans to phase out LED lighting production at its Giheung campus by 2030. Most employees...
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
