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NEWS TAGGED 2026
Saturday 8 November 2025
Sinbon eyes strong growth with orders from AI, robotics, and smart transport sectors in 4Q26
Electronic components and solutions provider Sinbon Electronics has faced significant pressure on its growth momentum in 2025 amid global economic volatility and shifting US policies...
Saturday 8 November 2025
WT Microelectronics sees strong 2026 growth on rising AI data center demand
WT Microelectronics expects strong momentum from AI-driven data centers to continue through 2026, citing surging global demand for computing and communications products.
Saturday 8 November 2025
Samsung folds strategy unit into Electronics arm as South Korean giants brace for 2026 leadership changes
South Korea's top conglomerates are reshaping their leadership and internal structures. They are bracing for an uncertain 2026 business cycle. Samsung is integrating its group-wide...
Saturday 8 November 2025
VIS turns corner after price war, gears up for PMIC-driven growth in 2026
Vanguard International Semiconductor (VIS) anticipates a mild slowdown in the fourth quarter of 2025 as seasonal demand eases and supply chain partners carry out year-end inventory...
Friday 7 November 2025
Catcher Technology enters AI server chassis market
Driven by growing demand for AI servers, Catcher Technology has joined the competitive server chassis components arena. Chairman Hung Shui-shu said the server segment is still in...
Friday 7 November 2025
Flexium Interconnect nears end of business transformation, eyes 2026 growth
Flexible printed circuit (FPC) manufacturer Flexium Interconnect said its challenging business transformation phase was approaching completion after a difficult 2025. The company...
Friday 7 November 2025
Samsung targets 2026 'second peak' with AI, foldables amid chip rebound
Samsung Electronics is betting big on artificial intelligence and foldable phones. The company hopes these technologies will drive what it calls a "second peak" in its smartphone...
Friday 7 November 2025
AP Memory revenue doubles as S-SiCap enters growth phase, eyes higher 4Q25
Memory design IC firm AP Memory reported consolidated revenue of NT$1.495 billion (US$48.3 million) in the third quarter of 2025, up 17.3% year-over-year, driven by multiple interposers...
Friday 7 November 2025
Acer unveils new pan-America leadership amid solid 3Q25 performance
Acer Inc. has announced a leadership transition at its Pan-America operations headquarters, as current regional president Gregg Prendergast is set to retire at the end of 2025. Effective...
Friday 7 November 2025
HDD delivery delays extend to 2 years as QLC NAND capacity sells out early
The surge in storage demand driven by AI servers has caused a severe shortage of traditional hard disk drives (HDDs), with delivery times reportedly extending beyond two years. Major...
Friday 7 November 2025
CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
Friday 7 November 2025
AUO turns loss amid weak seasonality and currency headwinds
Au Optronics (AUO) reported a swing to loss in the third quarter of 2025, citing weaker-than-expected panel seasonality and foreign exchange losses. The company warned that industry...
Friday 7 November 2025
Elan Microelectronics posts solid results, eyes AI-driven growth in 2026
Touch IC leader Elan Microelectronics held an earnings call on November 6, reporting that third-quarter performance exceeded internal forecasts despite a weaker consumer market than...
Friday 7 November 2025
Kinko Optical hits 9-year record on soaring infrared lens sales
Kinko Optical posted record October 2025 revenue of NT$405 million (approx. US$13.16 million), up 95.9% from a year earlier and 10.1% from September, the highest level in nine years...
Friday 7 November 2025
Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...