Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...
Japan-based Orbray plans to go public by 2029, aiming to raise up to JPY 10 billion. The company intends to strengthen production at its Akita factories and targets JPY 40 billion...
LG Display (LGD) is set to start mass production of its third-generation tandem OLED for automotive applications in 2026, aiming to enhance display brightness and durability.
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Recent rumors suggest that Apple is conducting research and development for its first "foldable iPhone," with a potential release targeted for 2026. Industry sources believe that...
Sharp's large-size LCD panel factory, Sakai Display Product (SDP), located in Osaka, Japan, is set to close by the end of September 2024. Sharp has offered an early retirement plan...
BYD reached an agreement with the Turkish government to invest $1 billion in building an electric and plug-in hybrid vehicle factory in the region. The new factory is set to start...
Fueled by the growing demand for advanced chips that require EUV lithography systems, Japan-based companies are increasing investments and eyeing the supply of materials used in critical...
Sunwoda, a prominent Chinese battery company, has made significant progress in developing all-solid-state batteries. The company aims to reduce the cost of polymer-based all-solid-state...
Due to rapid AI advancement and the increasing complexity of semiconductor chips, Advantest anticipates a growing demand for semiconductor testing equipment and intends to capitalize...
China plans to develop over 50 new national and industrial standards for the AI sector by 2026. These efforts are part of new guidelines aimed at standardizing systems within the...
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Following in the footsteps of the EU's regulations, India is reportedly considering implementing a timeline for standardized charging port requirements for consumer electronics by...
Sony's automotive CMOS Image Sensor (CIS) business is rapidly growing due to increasing demand for cameras in automobiles and the need for better image quality and functionality....
