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NEWS TAGGED 2026
Wednesday 20 May 2026
HCLTech Leads 'Agent-Native' Era for Enterprises at AI EXPO 2026

As Large Language Model (LLM) reasoning capabilities continue to evolve, AI Agents have officially surpassed passive "Copilots" to become the core of global digital transformation...

Wednesday 20 May 2026
Inside the LEO boom: How Starlink and rivals are reshaping global PCB supply chains
The global satellite communications industry is accelerating the deployment of next-generation infrastructure, unlocking the commercial potential of low-Earth-orbit (LEO) networks,...
Wednesday 20 May 2026
CXMT profit surge shows limits of China's DRAM push
ChangXin Memory Technologies (CXMT) is approaching its planned STAR Market IPO with sharply stronger earnings, as a global memory upcycle helps China's leading DRAM maker move closer...
Wednesday 20 May 2026
Sony, Nvidia, USC representatives discuss navigating the next wave of AI disruption
At the Plug and Play Silicon Valley May Summit 2026, industry leaders from Sony, Nvidia, and USC gathered to discuss the next phase of the AI revolution during the opening panel discussion,...
Tuesday 19 May 2026
DB HiTek's power-chip push hits delay as stakes rise
South Korean foundry operator DB HiTek is facing a slower ramp in silicon carbide (SiC) and gallium nitride (GaN), testing its push into next-generation power semiconductors as technology...
Tuesday 19 May 2026
ITE Tech awaits PC, NB visibility as price hikes begin in 2H26
ITE Tech's stable first-quarter results and planned price increases from the second half of 2026 signal potential cost pass-through across global PC, notebook, and embedded markets,...
Tuesday 19 May 2026
MediaTek probe jolts Taiwan lawmakers as market shifts
As of May 18, 2026, TSMC's market value stood at NT$58 trillion (US$1.8 billion), MediaTek's at NT$5.45 trillion, and Delta Electronics' at NT$5.2 trillion — the three largest...
Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Tuesday 19 May 2026
TDK expands bonding equipment investment, launches first mass production of nanocomposite materials
Japanese electronic components manufacturer TDK will make its largest-ever capital investment in fiscal 2026, running from April 2026 to March 2027, to address surging demand related...
Tuesday 19 May 2026
Commentary: TSMC Arizona profit tops SMIC and UMC combined, fueled by three key drivers
TSMC's Arizona fab has turned profitable, surprising the market and supply chain after years of warnings from founder Morris Chang and others that overseas fabs could lose money. Supply-chain...
Tuesday 19 May 2026
Mexico's new tariffs raise stakes for Taiwanese manufacturers
Mexico is overhauling its trade barriers, and Taiwanese manufacturers with operations there are only beginning to understand what that means for their bottom line.
Tuesday 19 May 2026
SpaceX listing buzz sends Taiwan's satellite suppliers into expansion mode

As the world races to build next-generation communications networks in low-Earth orbit (LEO), signs are emerging that Elon Musk's SpaceX...

Tuesday 19 May 2026
Satellite communications boom drives Winsemi, AWSC into W band
SpaceX's IPO preparations are accelerating the commercialization of low-Earth orbit (LEO) satellites, renewing global attention on satellite communications. The LEO sector's sharp...
Tuesday 19 May 2026
Liquid cooling spreads beyond AI GPUs as memory and network cards join adoption wave
Nvidia's fanless Vera Rubin AI server racks, slated for mass production in the second half of 2026, are expected to accelerate global adoption of liquid cooling across server components,...
Tuesday 19 May 2026
Arm faces US antitrust probe after announcing plan to design its own chips
Arm was notified by the US Federal Trade Commission in early 2026 that it was the subject of an antitrust investigation after the chip designer said it would begin engineering its...