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NEWS TAGGED 2026
Wednesday 5 August 2026
Analysis: AMD and Nvidia take opposite paths to capture next wave of AI infrastructure spending
Two earnings calls three months apart show AMD and Nvidia converging on the same AI infrastructure boom from opposite directions. AMD is building a single rack-scale platform, Helios,...
Wednesday 5 August 2026
Vanguard International Semiconductor lifts 2Q26 profit on AI server chip demand
Vanguard International Semiconductor (VIS) reported stronger second-quarter 2026 results on higher demand for AI server power management ICs, customer restocking and higher average...
Wednesday 5 August 2026
Smartphone makers brace for lower volumes, higher prices, and deeper market split
Apple, Qualcomm, and MediaTek delivered similar warnings last week: the global smartphone market is entering a more expensive, more polarized phase. For users, this means fewer affordable...
Wednesday 5 August 2026
Nanya Technology July revenue hits record as DDR4 contract prices surge

Nanya Technology Corporation reported July 2026 revenue of NT$43.868 billion(US$1.353 billion), up 49.27% from June and marking a new...

Wednesday 5 August 2026
FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...
Wednesday 5 August 2026
Wistron sees AI demand widening as Taiwan ODMs gain pricing power

AI demand is giving Taiwan's contract manufacturers a rare opening, and Wistron expects the opportunity to broaden in the second half...

Wednesday 5 August 2026
AMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips
AMD used its second-quarter 2026 results to reinforce a broader argument: that it can replicate in AI accelerators the market-share gains it has already made in server central processing...
Wednesday 5 August 2026
Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
US dominates world's largest AI data centers as China places three in global top 60
The global race to build AI data centers is accelerating. According to Epoch AI's latest AI Data Centers report, more than 60 hyperscale AI data centers have either entered operation...
Wednesday 5 August 2026
Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Wednesday 5 August 2026
China robot capital surges past US in global VC boom

Global venture capital has rebounded on the AI boom after the pandemic freeze, with total investment in the first half of 2026 already...