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NEWS TAGGED 2026
Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026
Ennoconn advances retail solutions with integrated hardware and services
Facing the AI wave, Ennoconn chairman Steve Chu revealed at an earnings call held on March 30, 2026, that its system integration revenue surpassed NT$20 billion (US$622.8 million)...
Thursday 2 April 2026
Top 10 Chart: Markets signal AI shift as Taiwan IC designers decouple from early-year revenues

Taiwan's IC design sector is undergoing a decisive shift in 2026, with capital markets effectively validating an industry transition toward...

Thursday 2 April 2026
Salesforce enters Taiwan, eyes local cloud services with AWS and Google Cloud
US CRM software provider Salesforce has established its Taiwan subsidiary and opened a Taipei office in early 2026, underscoring Taiwan's role in the global semiconductor and AI supply...
Wednesday 1 April 2026
Notebook shipment update, February 2026

Introduction

Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...
Wednesday 1 April 2026
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
Wednesday 1 April 2026
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
Wednesday 1 April 2026
Japan Display sells Tottori Fab, citing asset efficiency and continuing AutoTech work at a new site
Japan Display Inc. (JDI) signed a definitive agreement to sell its Tottori Fab to Yahata Touei Estate K.K., with handover scheduled for September 30, 2026; JDI said the transaction...
Wednesday 1 April 2026
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
Wednesday 1 April 2026
SDI targets AI and heat spreader growth
Power leadframe manufacturer SDI said it is benefiting from the gradual ramp-up of new applications related to artificial intelligence (AI), with around 40 new AI product projects...
Wednesday 1 April 2026
Infineon's power semiconductor content per kW to hit US$150 as 800V systems mature
Infineon held its "We Power AI" event in Taipei this week, marking the second consecutive year the company has hosted a large-scale forum in Taiwan focused on power-related technologies...
Wednesday 1 April 2026
Nvidia's 800V-to-12V push faces industry skepticism
Following Nvidia's promotion of its 800V-to-12V solution at the GPU Technology Conference (GTC) 2026, major power semiconductor and IDM players have successively launched related voltage...
Wednesday 1 April 2026
Foxconn advances AI supply chain localization, splitting work between US and Mexico
Foxconn's March 2026 capital campaign in North America signals a shift toward regionalized AI supply chains, promising shorter lead times, lower geopolitical risk, and improved delivery...