CONNECT WITH US

Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition

Joyce Chen, analysis; Jingyue Hsiao, DIGITIMES Asia 0

Credit: AFP

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and...

The article requires paid subscription. Subscribe Now