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Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt

Daniel Chimag, commentary Mar 5, 2026, 11:53 0

Hanwha Semitech announces development of second-generation hybrid bonding equipment. Credit: Hanwha Semitech

Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate development of hybrid bonding tools for HBM production. These newer entrants...

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