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UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers

Sherri Wang, DIGITIMES Asia, Taipei 0

An 8-inch TFLN wafer produced through HyperLight’s TFLN Chiplet platform. Credit: UMC

United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds in artificial intelligence computing clusters and data centers.

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