Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

DIGITIMES observes that, driven by demand for artificial intelligence (AI) and high-performance computing (HPC), the importance of advanced packaging continues to rise. Coupled with supply chain risks stemming from the long-standing concentration of capacity, as well as growing concerns over geopolitics and industrial security, global deployment patterns are shifting.

The US, supported by the CHIPS and Science Act and localization policies, is promoting capacity reshoring. Japan is strengthening integration capabilities through investments in front-end processes and materials technologies, while Korea is leveraging conglomerate resources and its long-established strengths in assembly and testing to advance packaging.

Meanwhile, Malaysia is absorbing capacity spillover through its mature OSAT cluster, gradually emerging as a key non-Taiwan extension node. Overall, the global advanced packaging supply chain is entering a new phase, shifting from a single-core deployment model to a multi-node structure.