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CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Charlene Chen, DIGITIMES Asia, Taipei

Apr 10, 2026, 11:01, Updated: Apr 10, 2026, 11:32 0

Credit: AFP

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According to TSMC's disclosures in an interview with CNBC, demand...

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