SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges

, DIGITIMES Asia, Taipei

May 26, 2026, 10:50 0

Credit: SK Hynix

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...

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