Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex

, Taipei

Jun 5, 2026, 16:59 0

Credit: DIGITIMES

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The...

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