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TGV still faces technical barriers; CoPoS commercialization not likely until 2030

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Google raised capex outlook as compute demand stayed tight, boosting Foxconn

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Xi'an Eswin Materials tops 1 million 12-inch wafer sales and output per month

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Rapidus builds a full semiconductor ecosystem in Hokkaido

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TSMC’s Arizona expansion moved past its initial hurdles as fabs and packaging ramped up

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Rising DRAM prices squeeze EV supply chains as Chinese automakers face cost pressure

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Alibaba Cloud founder: next-gen foundation models need scientific data

Amanda Liang, Taipei

Jul 24, 2026, 06:27 0

Credit: DIGITIMES

For the past three years, large language model (LLM) development has moved along the same track: models have gotten bigger, parameter counts have climbed, reasoning has improved, AI agents have matured, and long-context windows have kept breaking records. The...

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LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

AI Summit Seoul

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