As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical role in enabling next-generation package architectures. At SEMICON Taiwan 2026, Henkel Adhesive Technologies shared how it is helping customers address growing challenges in thermal management, reliability, processability, and package complexity through advanced materials and closer technical collaboration.
"Taiwan is a key market for us because of its leadership in semiconductor design, manufacturing, and advanced packaging," said Wen Zhou, Corporate Vice President and Global Head of Electronics at Henkel Adhesive Technologies. "Our strategy is to engage earlier in customers' innovation processes and support them in bringing next-generation technologies to market faster."
One of the solutions highlighted at SEMICON Taiwan was LOCTITE ABLESTIK CDF900, Henkel's next-generation conductive die attach film (cDAF). Designed for AI, HPC and advanced packaging applications, it delivers thermal conductivity exceeding 8 W/m-K to help address increasing heat dissipation requirements while supporting package reliability and miniaturization.
According to Zhou, AI is reshaping not only semiconductor demand, but also how companies innovate. As power densities rise and package architectures become more complex, challenges such as thermal management and stress control must be addressed at the system level. This is driving greater collaboration across the value chain and reinforcing the need for early co-design and co-optimization between materials suppliers and semiconductor manufacturers.
To accelerate innovation, Henkel is expanding its capabilities in Hsinchu, Taiwan, combining global R&D expertise with local technical support to help customers shorten development cycles, accelerate qualification, and move from concept to production more efficiently.
Celebrating its 150th anniversary in 2026 and backed by more than 30 years of semiconductor industry experience, Henkel continues to invest in technologies and partnerships that support AI infrastructure, advanced packaging, automotive electronics, and heterogeneous integration. Looking ahead, the company sees significant opportunities to collaborate with Taiwan's foundries, OSATs, design houses, and equipment partners as next-generation semiconductor innovation continues to accelerate
For full insights on Henkel's advanced packaging strategic innovation, watch the complete interview with Wen Zhou, Corporate Vice President and Global Head of Electronics at Henkel Adhesive Technologies. on YouTube.
