LG Chem reportedly developing MR-MUF materials for HBM on top of NCF work

Jessica Tsai

, Taipei

Nov 13, 2026, 10:02 0

Credit: AFP

LG Chem is developing materials for the mass reflow-molded underfill (MR-MUF) process used to make high-bandwidth memory (HBM), Korean media outlet ETNews reported, citing industry sources...

The article requires paid subscription. Subscribe Now

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

BIZ FOCUS

Nov 13, 08:00

APD Opens Shenzhen Facility, Advancing Dual-Plant Integration and Smart Manufacturing

MOST-READ
7 DAYS NEWS

Full list