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SK Hynix's HBM4 yield tops 70% as Samsung expands chip packaging capacity

, DIGITIMES, Taipei
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Credit: SK Hynix

SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources, as rival Samsung Electronics moves ahead with a major chip packaging...

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