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Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices
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Thursday 4 June 2026
Nvidia's Jensen Huang courts Korean giants in robotics expansion

Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates beyond semiconductors and into robotics, autonomous driving, and industrial automation, ETNews reported

Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory
Thursday 4 June 2026
Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, Nikkei Asia reported

Thursday 4 June 2026
Huawei's MineHarmony OS links 935 mining devices in China's smart mining push
Huawei's MineHarmony (Mine Harmony OS), a mining-focused industrial Internet of Things operating system jointly developed with China Energy Group, has surpassed 200 ecosystem partners and 935 certified devices, highlighting the growing adoption of domestically developed industrial software in China's mining sector
Thursday 4 June 2026
BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display maker to claim a first-mover title even as its production yield remains below 30%, according to ZDNet Korea

Thursday 4 June 2026
Japan's robotics legacy faces a new challenge: commercial success
At the close of his keynote address at the Humanoids Summit in Tokyo, Hiroshi Ishiguro — one of the pioneers of humanoid robotics — offered a candid assessment of the industry's progress: despite decades of investment and research, Japan has yet to produce a truly transformative, mass-market application for robotics
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to The Elec

Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company prepares for sustained growth in AI-driven storage demand
Thursday 4 June 2026
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal transmission time constant, known as τ, through multi-layer optimization across devices, circuits, architectures, systems, and algorithms
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea's memory equipment industry
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and rising NAND prices, according to Counterpoint Research
Wednesday 3 June 2026
Indian states pitch for Taiwan's electronics exodus during COMPUTEX
Five of India's most industrialized states sent high-level officials to pitch their regions as the next anchors for global electronics and AI supply chains this week at the 2026 Taiwan–India Investment Partnership Forum
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart