European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through the vicious cycle of weak demand, rising costs, and low capacity utilization, as well as difficulties in their transition to electric vehicles (EVs). However, the fact that Europe is utilizing subsidies and collaborative efforts to expand production with Chinese carmakers while confronting overcapacity issues on its home turf is, in the eyes of the US, an absurd situation, and Washington has not ruled out the possibility of further tariffs or import restrictions on European cars.

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips and data centers providing a stronger-than-expected tailwind, CEO Atsuyoshi Koike told Reuters.

The 2026 World Robot Conference (WRC) opened in Beijing on August 19, and the biggest change on this year's show floor was not the larger number of humanoid robots — it was that robots started working on site. From coffee making and retail service to printed circuit board (PCB) handling, logistics sorting, auto parts loading and unloading, and even home organizing, laundry, and table clearing, robot makers are no longer just showing robots walking, dancing, and boxing.

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value physical materials, Taiwan's Industrial Technology Research Institute (ITRI) said on August 21. Kuo-chan Chiou, director of ITRI's Material and Chemical Research Laboratories, said the island's materials supply chain is strengthening its capabilities as competition intensifies among Taiwan, Japan, and the US.

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies continue to evolve. Despite geopolitical headwinds, stronger local supply-chain resilience is accelerating the push toward materials self-sufficiency.