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Friday 31 July 2026
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration risk.
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Monday 3 August 2026
Chinese display makers reportedly double down on large LCDs and OLED expansion

China's leading display manufacturers are stepping up investments across both LCD and OLED technologies, targeting larger TV panels and expanding into the fast-growing notebook OLED market as they seek new growth opportunities.

Monday 3 August 2026
CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix
CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.
Monday 3 August 2026
TCL Technology to take full ownership of TCL CSOT
TCL Technology Group plans to pay CNY9.32 billion (approx. US$1.38 billion) for the 45% of China Star Optoelectronics Semiconductor Display Technology it does not already own, according to the registration-stage draft of the company's share-issue-and-cash asset purchase report, dated July 2026. The sellers are three Guangdong state-linked shareholders: Hengjian Investment (25.00%), Chengfa Investment (7.50%) and Science City Investment (12.50%).
Monday 3 August 2026
MA-tek sells Shanghai unit, expands AI market push in Japan and the US

MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.

Monday 3 August 2026
Drone delivery goes mainstream as Shenzhen becomes a robot hub
Meituan's drone delivery service can reach customers within 3 kilometers in about 15 minutes, rain or shine, and its daily use in Shenzhen is highlighting why the city has become a key launchpad for commercializing unmanned delivery. The city's dense supply chain, talent base, and innovation culture are helping turn robotics into a practical business.
Monday 3 August 2026
Renesas plans to phase out Takasaki factory production and expand R&D focus

Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.

Monday 3 August 2026
TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant, Sony, and other local semiconductor facilities.
Monday 3 August 2026
South Korea accelerates LEO satellite ambitions, targets sovereign communications network by 2035
As Starlink's subscriber base has surpassed 12 million and rivals such as OneWeb and Amazon's Project Kuiper continue expanding their constellations, South Korea only officially launched its low-Earth orbit (LEO) satellite communications initiative in July 2026.
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.

Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.
Monday 3 August 2026
IBM and Sarvam team up on India's sovereign AI push

IBM and Sarvam have announced a collaboration to advance sovereign AI technologies in India, a move that could influence how governments and regulated industries worldwide deploy trusted artificial intelligence. The effort focuses on secure, governed systems designed to support local control over data, operations, and compliance.

Monday 3 August 2026
Dixon sees mobile, IT hardware, and component push lift export and margin outlook

Dixon Technologies said its push into displays, camera modules, SSDs, and telecom hardware could deepen domestic value addition, even as near-term margins stay under pressure from input costs and the end of mobile PLI 1 incentives. The company expects joint venture-led expansion with Vivo and Inventec, plus PLI 2 and exports, to support growth.

Monday 3 August 2026
Rising component costs, new Indian incentives, and export push shape Dixon's outlook
Dixon Technologies said rising component prices pressured margins in the first quarter of fiscal 2027. Still, strong order inflows, a shift toward higher-value manufacturing, and new policy support could help offset the hit. The company sees mobile volumes improving, exports rising, and component localization deepening across its expanding portfolio.
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design tools, packaging facilities and AI infrastructure investments, aiming to strengthen domestic capabilities and reshape global technology supply chains.

Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions provider. FICG also signed an MOU with JTC, Singapore's government agency for industrial master planning and infrastructure development.