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Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity and technology development.
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Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.

Tuesday 15 September 2026
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
Tuesday 15 September 2026
China's humanoid robot race, Part 1: Mass production outruns proven demand

China's humanoid robot industry is moving from prototypes to industrial production. The next test is no longer whether robots can be built at scale, but whether they can work reliably and cheaply enough to make that scale economically viable.

Tuesday 15 September 2026
Minebea Mitsumi pauses M&A to chase AI hardware demand
Minebea Mitsumi has halted its push for new acquisitions and is shifting resources toward producing ball bearings, motors and actuators for AI hardware, as demand tied to data centers, humanoid robots and Nvidia components accelerates.
Tuesday 15 September 2026
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. For the first time, the plan identifies high-bandwidth flash memory and high-bandwidth memory as priority areas for next-generation memory research.
Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile application processor (AP), and repurposing the equipment for high-bandwidth memory (HBM) production.
Tuesday 15 September 2026
BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027

Polestar, the Swedish electric vehicle (EV) brand backed by Geely Holding, is facing a major restructuring of its US operations. In its first-half 2026 financial report filed with the US Securities and Exchange Commission (SEC) on September 3, Polestar said the US Department of Commerce's Bureau of Industry and Security (BIS) had denied its application for specific authorization under US connected vehicle regulations.

Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.

Tuesday 15 September 2026
China's space-computing race moves beyond single satellites: Shanghai's gigawatt-scale AI ambition lands in orbit
While the US showcases its strength as one of the world's established space powers — reinforced by SpaceX's growing dominance in satellite connectivity — a quieter but equally ambitious force is accelerating half a world away: China's push to build integrated, fully networked orbital infrastructure that goes beyond single-satellite launches.
Tuesday 15 September 2026
OEM/EMS AI servers: August revenue trends, operational outlook

Taiwan's original equipment manufacturer/electronics manufacturing services (OEM/EMS) sector is witnessing a structural split between explosive demand for artificial intelligence (AI) infrastructure and softening demand for legacy consumer device assembly in 2026. Monthly revenue data highlight how suppliers anchored to high-density compute racks, GPU-based servers, and high-speed network switches are delivering massive year-over-year gains, whereas manufacturers more reliant on standard notebooks face component supply bottlenecks.

Tuesday 15 September 2026
China's EV boom enters a phase of overcapacity cleanup
Within a relatively short span of time, China has built a formidable EV industry that has proved difficult for any other country to match globally, nurtured by years of industrial policy, infrastructure investment and government support.
Tuesday 15 September 2026
HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant

HS Hyosung Energy Solution Korea, a joint venture formed by South Korea's HS Hyosung Group and Belgian materials leader Umicore, signed a memorandum of understanding with Ulsan Metropolitan City on September 14 to construct a major silicon anode materials manufacturing base.

Tuesday 15 September 2026
Panasonic Energy eyes JPY1 trillion yen AI storage revenue by 2028

Panasonic Energy, the battery unit of Panasonic Holdings, is betting big on energy storage for AI data centers as demand for backup batteries from AI data centers surges. The company said it will keep energy storage systems (ESS) as a core growth driver and flex investment plans to match market demand.

Tuesday 15 September 2026
Tesla sets up Vietnam unit as VinFast dominates

Tesla has established a subsidiary in Vietnam as it prepares to enter the local market. Reuters reported that filing documents show the unit is registered in Ho Chi Minh City with capital of US$3 million.

Tuesday 15 September 2026
Chinese tech firms deepen open source push amid AI pacing debate

As US AI executives warn that artificial intelligence development may need to slow down, Chinese companies are pressing ahead with open source tools and large-scale deployment. The gap matters far beyond China, because the next phase of AI competition may be shaped as much by collaboration and standards as by chips and model size.