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Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials, including gallium oxide (Ga₂O₃) and synthetic diamond, in their draft development plan for the electronic information manufacturing sector.
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Monday 21 September 2026
US auto groups press Trump to block Chinese automakers from the market
Major US and global automakers, suppliers and dealers with factories in the United States urged President Donald Trump to keep Chinese automakers out of the American market ahead of the September 24 US-China summit. In a rare coordinated move, the industry groups warned that allowing Chinese carmakers into the US would raise security and competitive risks.
Monday 21 September 2026
SDC president declares foldable leadership, urges Korea to defend OLED advantage

Facing aggressive expansion by Chinese competitors, Samsung Display (SDC) president and Korea Display Industry Association (KDIA) chairman Chung Yi expressed strong confidence in SDC's foldable panel capabilities. However, he warned that rival nations are funneling funds and expertise gained during the LCD era into OLED development. He called on South Korea to unite industry, government, academia, and research sectors to prevent a repeat of the loss of market leadership that occurred in the LCD industry.

Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project in Bao'an, Shenzhen, with total investment expected to be at least CNY12 billion (approx. US$1.79 billion). The new site is designed to add four factories and expand the company's ability to develop, manufacture, and deliver high-end flip-chip ball grid array (FCBGA) products for AI, high-performance computing (HPC), and advanced packaging customers.

Monday 21 September 2026
Taiwan delays 2026 power rate decision as war drives fuel costs higher

Taiwan's Ministry of Economic Affairs delayed a 2026 electricity rate decision on September 18 after the Middle East war pushed up fuel prices and raised Taiwan Power's generation costs. The ministry said it would first seek NT$71.1 billion (approx. US$2.24 billion) in government funding, while the current tariff will stay in place through December 2026.

Monday 21 September 2026
Rebellions chips process over 4 billion tokens a day for SK Telecom
South Korean AI chipmaker Rebellions has expanded its neural processing units (NPUs) across four commercial SK Telecom services, with the infrastructure now processing about 14 million real-time requests and more than 4 billion tokens a day.
Monday 21 September 2026
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator (FD-SOI), while China is building a domestic supply chain spanning substrates, foundry capacity, and chip design.

Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon photonics (SiPh), silicon germanium (SiGe), and advanced packaging capacity in the Hokuriku region, as demand from AI data centers accelerates.

Monday 21 September 2026
Z.ai's ZCode crisis exposes AI coding's enterprise trust gap
Chinese AI developer Z.ai has open-sourced its ZCode coding tool and is preparing a zero-data-retention option for its Model-as-a-Service (MaaS) platform after ZCode was found packaging local code repositories and attempting to upload them to the cloud.
Monday 21 September 2026
Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
GalaxyCore Inc. plans to raise up to CNY4.2 billion (US$627 million) to expand 12-inch CMOS image sensor (CIS) capacity and develop 100MP and 200MP sensors, doubling down on higher-value imaging after its first Fab-Lite investment took longer than expected to deliver returns.
Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move that could improve how solar performance is measured and compared worldwide. The new rules are likely to support industry transparency, help investors assess progress more accurately, and speed commercialization by reducing inconsistencies in testing data across markets.

Monday 21 September 2026
Acer taps local health data to build sovereign healthcare AI

Acer Medical said Taiwan's and South Korea's long-standing health insurance and medical records could underpin a new wave of sovereign healthcare AI as the company moves beyond image recognition into generative AI and AI agents. The company highlighted uses in remote care, motion analysis, and preventive medicine at a Next AI event in Wonju, South Korea.

Monday 21 September 2026
DB HiTek gains pricing power as 8-inch supply tightens

South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management chips improve conditions across mature-node manufacturing.

Monday 21 September 2026
China monitor market splits as commercial demand holds up, premium displays gain ground

China's PC monitor market is entering a period of sharper structural divergence, with commercial demand offsetting part of a weakening consumer segment while rising component costs push manufacturers toward higher-value products.

Monday 21 September 2026
CXMT closes in on DRAM leaders with G5 process breakthrough

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the industry's most advanced mass-production nodes and bringing higher-density LPDDR5X into volume production.

Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's TPU-driven ASIC demand to equipment shortages and packaging debates that could slow capacity expansion. Taiwan's Physical AI discussions emphasized system integration over components, while China's semiconductor researchers outlined a DUV-based sub-3nm GAA path. Beijing also moved to restrict civilian drones starting in November sharply. Below are the most-read DIGITIMES stories from September 14 to September 20, 2026