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Wednesday 4 November 2026
Decoy processors carry Korean HBM past US export controls into China
A loophole in US export controls reportedly lets high-bandwidth memory (HBM) made by Samsung Electronics and SK Hynix reach China's AI chip industry. The loophole shows how much Huawei's next-generation processors still depend on foreign memory, while China's domestic suppliers struggle to close the gap.
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Thursday 5 November 2026
Qisda revenue rises 13% in October as AI businesses accelerate
Qisda posted October consolidated revenue of NT$19.39 billion (US$590.8 million), up 13.47% year-over-year but down 1.85% from September, as its AI infrastructure, AI solutions, and smart manufacturing, and AI healthcare businesses all recorded double-digit growth from a year earlier.
Thursday 5 November 2026
China's Big Fund III pivots to 12-inch chip fabs, equipment acquisitions to close semiconductor supply chain gaps
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and industry consolidation, with a CNY900 million (approx. US$134 million) capital injection into Silan Microelectronics' 12-inch analog chip project highlighting its latest priorities.
Thursday 5 November 2026
SDC auto OLED shortage leads Li Auto to ship new Mega with LCDs
Samsung Display (SDC) is facing a shortage of automotive OLED panels supplied to Chinese EV maker Li Auto, prompting Li Auto to temporarily ship some new Mega vehicles with LCD panels. Strong vehicle sales have driven demand for high-specification displays beyond expectations, potentially giving SDC's automotive OLED business fresh momentum.
Thursday 5 November 2026
Apple opens AI beta in China with Qwen-integrated Siri
Apple has opened testing of its China-specific Apple Intelligence service with the iOS 27.3 developer beta released on November 4, integrating Alibaba's Qwen model into Siri. The full version is expected in December, as Apple works to close the gap in its generative AI offerings in China.
Thursday 5 November 2026
Commentary: AOI locks in China's InP substrates for AI optics, but export controls threaten supply
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical upstream materials. Indium phosphide (InP), a key substrate for high-speed optical lasers and optoelectronic devices, is increasingly sought after as 800G and 1.6T transceivers gain traction. With capacity expansion requiring time and product qualification presenting technical hurdles, securing InP wafer supplies has become a strategic priority for optical communications companies.
Thursday 5 November 2026
South Korea's Moreh claims AMD MI355X delivers over twice Nvidia B200's inference throughput
South Korean AI software developer Moreh says AMD Instinct MI355X GPUs running its inference software delivered more than twice the throughput of Nvidia B200 GPUs in company tests, as South Korea moves ahead with plans to build AI infrastructure combining AMD processors with locally developed chips.
Thursday 5 November 2026
Naver Cloud ramps up use of AMD EPYC, citing high Intel CPU costs
South Korean cloud services provider Naver Cloud now runs AMD EPYC processors in about 35,000 servers and plans to deploy 144-core fifth-generation EPYC chips in its public cloud services in the second half of 2026. The company turned to AMD after high prices for Intel's higher-core-count processors slowed its server expansion.
Thursday 5 November 2026
Taiwan accelerates unmanned boat fleet as experts urge allied cooperation
The Research Institute for Democracy, Society and Emerging Technology (DSET) released a report on November 4 at the 2026 Taiwan Marine Tech & Unmanned Robotics Expo (MATURE Taiwan), examining Taiwan's unmanned boat industry and international cooperation. Experts from Ukraine and the US urged Taiwan and its allies to connect technology networks and move faster.
Thursday 5 November 2026
US pressure on overseas AI compute squeezes Chinese tenants and Southeast Asian data centers as Beijing pushes domestic chips
Chinese AI developers are losing a key route to advanced US chips, renting them in data centers outside China, as Washington and US companies stretch American controls over compute well beyond US borders. The squeeze falls heavily on Southeast Asian data center operators that built capacity around Chinese demand. Beijing, meanwhile, is pressing its own tech giants to rely less on American hardware.
Thursday 5 November 2026
Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.
Thursday 5 November 2026
MUFG, SMBC to renew JPY600 billion credit lines for scandal-hit Nidec
Mitsubishi UFJ Financial Group's MUFG Bank and Sumitomo Mitsui Financial Group's Sumitomo Mitsui Banking (SMBC) plan to renew a combined JPY600 billion (approx. US$3.8 billion) in credit facilities for Nidec through November 2027, providing financial support as the Japanese electric motor maker works to restore confidence following an accounting scandal, according to Nikkei Asia.
Thursday 5 November 2026
CXMT prepayments surge 16x with DRAM shortage lifting market share
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory (HBM) and advanced DRAM, the tightening supply of mainstream DRAM is allowing CXMT to capitalise on domestic demand and capacity expansion.
Thursday 5 November 2026
Mitsui Chemicals reportedly plans US$8.2B acquisition of JSR in Japan chip materials push
Mitsui Chemicals is planning to acquire semiconductor materials maker JSR from state-backed Japan Investment (JIC) in a deal potentially worth more than JPY1.3 trillion (US$8.2 billion), which would rank as the largest acquisition in Japan's chemicals sector, according to reports by Nikkei Asia and Reuters on November 4, 2026.
Thursday 5 November 2026
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest in the US, starting to reshape the company's manufacturing footprint in India.
Thursday 5 November 2026
FPT starts chip-testing plant trials in northern Vietnam, plans packaging expansion
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging technologies. The facility has six production lines and a maximum designed capacity of 300 million chips annually, the company said in a November 3 release.