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Thursday 15 January 2026
China takes cautious stance on US H200 chip export, prioritizes local chipmakers
The US government confirmed this week the conditions for exporting the H200 AI chip to China, reportedly including third-party lab testing before shipment to ensure compliance with AI technology standards. Additionally, the number of AI chips sold to Chinese customers cannot exceed 50% of those sold to US customers. Chinese buyers must also prove they have implemented sufficient security measures and that the chips will not be used for military purposes
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Thursday 15 January 2026
Delta Electronics plans major manufacturing expansion in India to support 'Make in India' push
Delta Electronics India is set to significantly expand its manufacturing footprint in India, reflecting the company's confidence in the country's growing semiconductor and electronics ecosystem and its alignment with the government's 'Make in India' initiative. The move builds on Delta's longstanding presence in India, where the company has invested in R&D, industrial automation, and smart manufacturing solutions over the past decade
Thursday 15 January 2026
Reliance plans AI platform to bring language-first access to every Indian
Reliance Industries, led by billionaire Mukesh Ambani, unveiled plans for a new artificial intelligence (AI) platform under its Jio brand on January 11, designed to allow users to access AI services in their own language. The announcement, made at the Vibrant Gujarat Regional Conference in Rajkot, underscores Reliance's push to scale AI infrastructure and applications nationwide
Thursday 15 January 2026
South Korea's memory chip giants pivot back to capacity expansion

As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix, are expected to post record operating profits in 2026. Combined operating profit could exceed KRW300 trillion (approx. US$210 billion), roughly double the level recorded in 2025

Thursday 15 January 2026
Maxscend's first annual loss exposes fab-lite strain and legal risks
Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business transition, intensifying competition, and mounting legal pressure from Japan's Murata Manufacturing
Thursday 15 January 2026
Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite deployments expand and the industry moves toward 6G, the company's electromagnetic interference shielding equipment is also gaining importance
Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products
Thursday 15 January 2026
Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing made on January 14, marking a key step in operationalising their collaboration in India's chip ecosystem, according to PTI and the Economic Times
Thursday 15 January 2026
Japan fortifies rare-earth supply chain against China risk
China has tightened export controls on rare earths and other dual-use materials bound for Japan, prompting Tokyo to formalise a rare-earth stockpiling policy and work with G7 partners to accelerate efforts to reduce supply-chain dependence on China
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation packaging and interconnect requirements for AI servers, high-performance computing (HPC), and advanced networking systems
Wednesday 14 January 2026
China tech restrictions complicate Reliance battery cell plans
Reports that Reliance Industries has paused plans to manufacture lithium-ion battery cells have reignited debate over India's clean-energy ambitions, highlighting technology bottlenecks even as the conglomerate insists its net-zero strategy and investment roadmap remain firmly on track
Wednesday 14 January 2026
China lifts semiconductor equipment localization to 35%
China's push to localize its semiconductor equipment supply chain has reached an unexpected milestone. Domestic tools accounted for 35% of chipmaking equipment used in 2025, up from 25% a year earlier and well above the government's original 30% target. Data from Jiemian News, SCMP, and Cacnews show localization has risen from just 7% in 2020, a nearly 400% increase in five years. In key process steps such as etching and thin-film deposition, Chinese tools now exceed 40% adoption
Wednesday 14 January 2026
Ola Electric enters residential energy storage market with Shakti BESS launch
EV manufacturer Ola Electric has rolled out Ola Shakti, a residential battery energy storage system (BESS), from its gigafactory in the Krishnagiri district of Tamil Nadu, marking the company's formal entry into India's residential energy storage market and an expansion beyond its core automotive business, according to ANI, PV Magazine, and the Economic Times
Wednesday 14 January 2026
SK Hynix to invest in new advanced packaging plant amid AI memory demand
SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea. The move aims to meet growing demand for AI memory and bolster the company's semiconductor capabilities, particularly in high bandwidth memory (HBM)
Wednesday 14 January 2026
Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET News and The Elec, Samsung is in the final evaluation stages of its EUV mask blanks with local supplier S&S Tech and is expected to be completed by January 2026, or by February at the latest. This is the first time Samsung will use domestically produced mask blanks in its EUV process
Wednesday 14 January 2026
SK Hynix reportedly trims consumer memory, shifts focus to servers

Surging demand for AI hardware is prompting memory makers to reassess their product portfolios as resources shift toward higher-margin enterprise and data center markets. Following Micron's decision to exit its Crucial consumer business late last year, market speculation has emerged that SK Hynix may also be reviewing its exposure to consumer-grade memory products