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Wednesday 14 October 2026
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on smaller process nodes. Its next-generation Kirin chip, scheduled for 2027, has entered testing, with initial results meeting expectations.
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Wednesday 14 October 2026
Tata's flagship chip fab faces pressure from its own shareholders
Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses for quicker returns on capital-intensive bets.
Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising questions about the chipmaker's expansion plans as rising conventional DRAM prices create competing opportunities for capital spending.
Wednesday 14 October 2026
Nvidia's share of China's AI chips falls by a third while Huawei gains
Nvidia's share of AI chips in China's data center market has fallen by 34% in the first half of this year, according to a new report. The drop follows months of US restrictions on advanced chip sales to the country, Chinese authorities' push to rely less on Nvidia imports, and domestic players like Huawei moving to fill in this supply gap.
Wednesday 14 October 2026
JCET redirects Korean factories towards AI to counter weak smartphone growth
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure demand. The company expects benefits from the transformation of its South Korean operations to emerge from the second half of 2026 and to become more pronounced in 2027 and 2028, according to a recently released investor relations activity record.
Wednesday 14 October 2026
LGD's KRW104.1B auto LCD module sale collapses
LG Display (LGD) has canceled the planned sale of its automotive LCD module business at its Nanjing subsidiary, losing a potential KRW104.1 billion (about US$72 million) payment and delaying plans to improve production efficiency.
Wednesday 14 October 2026
TOK expands Koriyama photoresist capacity as AI chip demand rises
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials market, particularly photoresists. The company announced on October 8 that a new facility at its Koriyama plant had been completed and that it plans to expand the site further.
Wednesday 14 October 2026
HBM capacity shift sends DDR4 contract prices rising faster than DDR5
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted memory manufacturers to expand high-bandwidth memory (HBM) production while scaling back legacy DRAM capacity, tightening DDR4 supply and lifting contract prices.
Wednesday 14 October 2026
Adani and Jabil plan 50:50 JV to make AI data center hardware in India
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up may help meet rising demand for data center hardware, lower supply risks, and widen access to AI infrastructure worldwide.
Wednesday 14 October 2026
CEATEC 2026 showcases physical AI, smart infrastructure
Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, bringing together 821 companies and organizations from Japan and overseas to showcase Physical AI, smart infrastructure maintenance, and disaster-prevention simulations. The four-day event runs through October 16 and highlights how AI is moving beyond generative tools to control robots and connected devices across industry and daily life.
Wednesday 14 October 2026
Yaskawa targets 2030 humanoid robot rollout as AI lifts forecast
Japan's Yaskawa Electric plans to launch humanoid robots within the next one to two years and expects AI-powered humanoid robots to enter widespread use around 2030. The company also raised its revenue and net profit forecasts for fiscal 2026, citing a weaker yen, while lowering its operating profit forecast.
Wednesday 14 October 2026
KYEC signs advanced payment deal with Nvidia for US testing expansion
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under the arrangement, Nvidia will make advance payments to support KYEC and its US subsidiary AeternZ Semiconductor Testing in building local testing capacity, while securing capacity for Nvidia. The payments will be gradually offset through the provision of testing services.
Wednesday 14 October 2026
Chinese automakers face three hidden barriers in European expansion
China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected in their domestic market cannot be seamlessly replicated in Europe. Currently, at least three hidden barriers test their cross-border adaptability.
Wednesday 14 October 2026
China’s NEV export rebate cut puts budget EV makers under margin pressure
China will reduce its export tax rebate for new energy vehicles (NEVs) from 13% to 9% on April 1, 2027, increasing cost pressure on automakers, particularly those selling lower-priced models with thin profit margins. The Ministry of Finance and State Taxation Administration announced the four-percentage-point reduction on October 12.
Wednesday 14 October 2026
TCC wins approval for Europe listing plan
TCC Group Holdings (TCC) shareholders approved a plan on October 13 for subsidiary Cimpor International Holdings to pursue an initial public offering (IPO) and listing on a European securities market. The resolution received 4,287,569,701 votes in favor, representing 94.74% of voting rights represented at the vote, as the company sought to create a new funding channel for its European operations while maintaining Taiwan-based control of the business.
Wednesday 14 October 2026
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D packaging for greater power efficiency, optical interconnects for faster data transmission, and open software ecosystems for easier adoption—will determine whether Chinese GPUs can advance from standalone accelerators to large-scale AI computing clusters.