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Monday 10 August 2026
Commentary: What the DeepSeek-Unitree tie-up reveals about China's hard-tech financing
DeepSeek's participation in Unitree's Shanghai STAR Market IPO was made at the corporate level, not personally by founder Liang Wenfeng or a fund associated with him.
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Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant to a growing list of multinationals reassessing their presence in the country, Bloomberg reported.
Tuesday 11 August 2026
China's tightening visa curbs test India's electronics manufacturing ambitions

Beijing's decision to sharply cut approval rates for Indian business travelers is exposing a structural weakness in India's push to scale up electronics manufacturing: the country still cannot get enough Chinese equipment, components, and technical staff into its factories without China's cooperation.

Tuesday 11 August 2026
Samsung races to qualify Taylor fab as 2nm demand turns US capacity into a strategic asset

Following growing momentum behind large-scale infrastructure buildouts in South Korea, the industry is witnessing an aggressive wave of AI-related initiatives aimed at expanding the nation's semiconductor production capacity. But the broader objective extends beyond capacity ramps alone toward building a more self-reinforcing semiconductor ecosystem across some of the most critical stages of advanced chip manufacturing.

Tuesday 11 August 2026
YAGEO, Walsin post record July sales as AI demand lifts passive components
YAGEO and Walsin Technology reported strong July 2026 revenue as artificial intelligence demand continued to lift Taiwan's passive components sector. Both companies said orders from AI-related, networking, industrial, and automotive customers remained solid, while capacity utilization remained high.
Tuesday 11 August 2026
China silicon wafer expansion accelerates: Eswin scales 12-inch capacity, Lion Micro consolidates 6- and 8-inch assets

China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material Technology investing further in a 12-inch wafer base in Wuhan while Hangzhou Lion Microelectronics moves to take full control of Zhejiang Jinruihong Technologies.

Tuesday 11 August 2026
Weak China auto demand sends parts maker Hiroca deeper into North America, Japan
Hiroca Holdings reported consolidated revenue of NT$370 million (approx. US$11.5 million) for July, down 17.2% from the previous month and 16.7% from a year earlier. Consolidated revenue for the first seven months of 2026 reached NT$2.89 billion, down 2.07% year-over-year.
Tuesday 11 August 2026
Jiuhan lifts first-half profit 400% on NT$11 billion order book
Jiuhan System Technology reported record second-quarter and first-half 2026 revenue and profit on strong demand tied to advanced semiconductor manufacturing and AI infrastructure. The Taiwanese builder said its order book stood at NT$11 billion as of the end of July, giving it visibility for the next two to three years.
Tuesday 11 August 2026
UMC revenue climbs to a 45-month high as wafer prices rise
United Microelectronics Corporation (UMC) reported July 2026 consolidated revenue of NT$23.84 billion, up 1.8% from June and 18.98% from a year earlier, marking the highest level in 45 months. The foundry said the result came as wafer shipments increased, while higher wafer foundry prices in the second half of 2026 are expected to support further revenue growth.
Tuesday 11 August 2026
China's AMIES lands repeat orders for 350nm lithography system

Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography system after passing process validation at a leading Chinese compound-semiconductor customer, extending the company's reach beyond its established advanced-packaging equipment business.

Tuesday 11 August 2026
Memory crunch pushes Apple toward China—and into Washington's security dilemma

Apple's unusual interest in testing CXMT memory and redirecting part of its procurement toward China has rattled Washington, given the years-long US effort to curb China's rise across strategic segments of the semiconductor industry.

Tuesday 11 August 2026
Samsung set to double BOE TV panel orders as Korean TV makers reshuffle suppliers

Samsung Electronics is expected to double its purchases of TV LCD panels from BOE in 2026 while cutting orders from CSOT, as Samsung and LG Electronics rebalance their supplier mixes in an LCD market increasingly dominated by Chinese panel makers.

Tuesday 11 August 2026
PSA, NTUT sign NT$50 million AI research and talent deal
Passive System Alliance (PSA) Group and National Taipei University of Technology have signed a three-year industry-academia agreement worth NT$50 million to advance artificial intelligence research and workforce development. The partnership, set to begin in the fourth quarter of 2026, brings together PSA Group companies including Walsin Technology, Walton Advanced Engineering, HannStar Board Corporation, and INPAQ Technology with NTUT’s engineering and AI capabilities.
Tuesday 11 August 2026
Google's US$15B India AI data center faces environmental backlash

Google's planned AI data center in Andhra Pradesh, India, has drawn its first major opposition, with environmental groups protesting over water rights and wildlife concerns. The project, announced in October 2025, calls for US$15 billion in investment over five years and includes participation from Adani Group.

Monday 10 August 2026
SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an outside investor or selling a stake in the operation, which could be valued at about US$3 billion, as the memory chipmaker ramps up investment in South Korea.

Monday 10 August 2026
FCC 26-50 extends US tech controls to chips, optical transceivers and supply-chain origins

US technology controls are reaching deeper into communications supply chains. Under FCC 26-50, the Federal Communications Commission no longer focuses only on brands or final assembly. Its emerging framework now extends to chips, modules, software, firmware, design ownership, production location and supply-chain control, raising new compliance risks for optical transceivers, networking equipment and ODM suppliers.