Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels

As artificial intelligence drives an insatiable demand for computing power, China is beginning to look beyond terrestrial data centers and edge computing toward a new frontier: space