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Wednesday 23 September 2026
Micron's Taiwan fab took 300,000 cubic meters of concrete. Its supplier sees more coming

Taiwanese concrete-maker Goldsun Building Materials said its Miaoli plant has benefited from rising construction demand tied to AI, semiconductor, and data center projects in Taiwan's Miaoli County. The company expects the government-backed Taoyuan-Hsinchu-Miaoli Silicon Valley plan to bring more factory work and support steady revenue growth.

Wednesday 23 September 2026
Seven Chinese AI companies hit US$10.7 billion ARR, but the harder race is paying for scale

China's leading AI developers are scaling revenue rapidly, but the gap with their US rivals remains substantial — and the cost of keeping pace is rising even faster. Rhodium Group estimates that seven major Chinese AI companies had combined annualized recurring revenue (ARR) of about US$10.7 billion, based on estimates dated between March and August 2026, roughly one-tenth of the more than US$100 billion attributed to OpenAI and Anthropic combined.

Wednesday 23 September 2026
Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's M100 at Level I among AI training and inference chips. The same assessment also gave the highest Level III rating to several general-purpose CPUs, including Loongson and HiSilicon Kunpeng products, signalling that certification is becoming a more structured gatekeeper for China's locally developed compute infrastructure.
Tuesday 22 September 2026
Vivo unveils X500 strategy to bolster premium phone push

Vivo unveiled its new X500 series imaging flagship phones in Shanghai on September 21, 2026, aiming to build a stronger moat in mobile imaging and break through more aggressively in the premium smartphone market. As rising memory prices force handset makers to lift retail prices, IDC expects worldwide smartphone shipments to fall 16.7% in 2026 to just over 1 billion units.

Tuesday 22 September 2026
Tmytek lists on Taiwan Innovation Board, pushes 5G/6G, satellite, defense

Millimeter-wave communications technology and solutions provider TMY Technology (Tmytek) officially listed on Taiwan's Innovation Board on September 22 at an offering price of NT$60 (approx. US$1.90) per share. The company said its products, which span millimeter-wave R&D and validation instruments, Lego-like phased-array antennas and subsystem modules, have moved from development and verification into commercial delivery and mass production.

Tuesday 22 September 2026
Unitree targets humanoid robots' next bottleneck with 22-DoF Dex5-S hand
Humanoid robot makers are accelerating investment in dexterous hands as the component becomes increasingly important to fine manipulation. Chinese robotics company Unitree Robotics launched its new Dex5-S dexterous hand on September 21, raising the degrees of freedom to 22 and adopting dimensions close to those of a human hand. Prices start at CNY39,900 (approx. US$6,000), underscoring a shift from demonstration-focused products toward practical tasks and deeper integration with complete humanoid robot systems.
Tuesday 22 September 2026
Microsoft opens fourth India cloud region, casting Hyderabad as an AI hub for Asia and the Global South
Microsoft has turned a headline slice of its US$20.5 billion India commitment into operating infrastructure, opening a Hyderabad cloud region it intends to serve customers well beyond India's borders. The move positions the country as a supply base for AI compute at a moment when it generates far more data than it can process at home.
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM) into the broader system semiconductor packaging market.
Tuesday 22 September 2026
Alibaba speeds V900 rollout, targeting 20GW of data centers
Alibaba Group is accelerating the rollout of its next-generation Zhenwu V900 accelerator by about six months as it expands a vertically integrated computing platform spanning processors, networking, storage and data centers.
Tuesday 22 September 2026
Taiwan virtual asset law to help lower supply chain transaction costs

Taiwan's Legislative Yuan passed the Virtual Asset Service Act in June 2026, and Taiwan's Financial Supervisory Commission (FSC) is now drafting delegated regulations, with completion planned for the first quarter of 2027. PwC Taiwan managing director Monica Lee said banks will need licenses to operate virtual asset services, and lending licenses are the most likely to be profitable.

Tuesday 22 September 2026
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the future, and that a batch of training chips from Huawei are set to begin arriving at his company as early as the fourth quarter of 2026.

Tuesday 22 September 2026
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can balance power consumption, thermal performance, and AI computing capability.
Tuesday 22 September 2026
Chinese automakers step up battery in-house push to reclaim cost control

As Li Auto, NIO, Xiaomi, Geely, GAC, GWM, Chongqing Changan Automobile, and Chery step up efforts to develop and manufacture batteries in-house, the tug-of-war between China's automakers and battery leader CATL over self-production versus outsourcing is intensifying.

Tuesday 22 September 2026
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group chairman Joe Tsai made a rare appearance at the opening ceremony and said AI is moving from frontier exploration toward real-world deployment and large-scale applications.
Tuesday 22 September 2026
BOE looks beyond displays with glass substrates for AI packaging
Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that the company's glass substrates are undergoing customer validation, marking a shift from technology development toward customer adoption.