Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with the matter. Originally slated for sample testing in July 2025, the schedule has reportedly been pushed back to October due to complications in the redesign process. Insiders say the situation remains fluid, with yield rates still uncertain, raising concerns that the timeline for mass-producing HBM4 chips, which rely on 1c DRAM, may also be affected
As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging technologies
Huawei's CloudMatrix 384 (CM384) is making waves as the most ambitious AI hardware rollout in China to date—a rack-scale system powered by 384 Ascend 910C chips and positioned as a direct competitor to Nvidia's GB200 NVL72
