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    HomeRegionsEast Asia
    Monday 18 August 2025
    LGD showcases new generation of in-car interactive displays
    LG Display (LGD), optimistic about the automotive market outlook, showcased a fully autonomous driving concept car equipped with various innovative display solutions at K-Display 2025. The company also won awards for its globally largest 57-inch full cockpit pillar-to-pillar (P2P) display and automotive slidable OLED screen
    Monday 18 August 2025
    Hua Hong Semiconductor to acquire HLMC to expand 12-inch chipmaking capacity

    Hua Hong Semiconductor announced on August 17 that it will acquire a controlling stake in Shanghai Huali Microelectronics Corporation (HLMC), a unit of Shanghai Huahong (Group), via a mix of share issuance and cash. The planned deal, alongside a fundraising package, aims to streamline overlapping businesses and boost wafer capacity as competition heats up in the contract chipmaking sector

    Monday 18 August 2025
    Dixon Technologies, HKC seal joint venture agreement for display manufacturing in India
    Dixon Technologies formed a joint venture with China's HKC, highlighting a thaw in India-China business ties, even as US President Donald Trump's 50% tariff on Indian goods unsettles global trade. The deal underscores India's balancing act, welcoming Chinese investment to boost manufacturing while navigating shifting geopolitical and economic headwinds
    Monday 18 August 2025
    Huawei escalates IP battle with Africa's dominant smartphone vendor
    Chinese handset maker Shenzhen Transsion Holdings Co., known as the "king of phones in Africa," is facing a fresh legal challenge from Huawei, highlighting growing intellectual property risks as it expands into emerging markets where Xiaomi and other rivals are gaining ground
    Monday 18 August 2025
    ASML's uneasy role in the tech war: What 3 years inside the Dutch giant reveal about US–China rivalry
    The United States has steadily ratcheted up export controls on semiconductor technology to China, with its ban on ASML's extreme ultraviolet (EUV) lithography machines standing as the single most consequential measure. Washington frames the move as a national security imperative, designed to prevent Beijing from mass-producing the world's most advanced chips
    Monday 18 August 2025
    Huawei tests China's first HBM3 as CXMT accelerates expansion to counter supply squeeze
    China's push for self-reliance in artificial intelligence (AI) semiconductors is running into fresh obstacles as Washington tightens controls on advanced memory. In response, ChangXin Memory Technologies (CXMT) is reviving delayed investment plans to mass-produce DDR5 DRAM and accelerate development of fourth-generation high-bandwidth memory (HBM3)
    Monday 18 August 2025
    Weekly news roundup: Apple's US$599 MacBook, China's HBM3 breakthrough, and TSMC 2nm leak update
    Below are the top DIGITIMES Asia stories from August 11 to 17, 2025. Leading the headlines: Apple is preparing to launch a US$599 MacBook, with mass production of key components expected by the end of 2025. China's leading DRAM manufacturer has begun domestic production of HBM3 chips, with samples already sent to Huawei for final validation. Meanwhile, a reported leak of TSMC's 2nm technology involving employees from TSMC and Tokyo Electron (TEL) sparked espionage concerns but appears less severe after further investigation
    Monday 18 August 2025
    SK Hynix labor dispute delays Nvidia HBM supply talks
    A proposed bonus exceeding KRW100 million (US$72,000) per employee threatens to spark SK Hynix's first full-scale strike, with stalled high-bandwidth memory (HBM) supply talks heightening industry concerns over a protracted labor standoff
    Monday 18 August 2025
    Samsung DRAM market share sinks to decade low, consumer electronics cushion the blow
    Samsung Electronics' global DRAM market share slipped to 32.7% in the first half of 2025, down 8.8% from 41.5% a year earlier, according to its August 14 semiannual earnings report, raising concerns over its grip on industry leadership
    Monday 18 August 2025
    Samsung signs DeepX for 2nm process to advance GenAI computing at the edge
    Global pioneer in ultra-low-power AI semiconductors, DeepX, has recently become one of Samsung Electronics' foundry clients utilizing its 2nm semiconductor manufacturing process. DeepX plans to apply Samsung's 2nm technology to develop its next-generation generative AI (GenAI) chip, the "DX-M2.
    Monday 18 August 2025
    China commands 60% of global AI patents, races to close US gap in computing power
    China is entering the second half of 2025 by reviewing its "14th Five-Year Plan" technology milestones and mapping priorities for the upcoming "15th Five-Year Plan." Liu Liehong, administrator and director of the National Data Administration (NDA), said on August 14 that by June 2025, China's total computing power ranked second worldwide and the country held 60% of global AI patents, underscoring its rising weight in AI R&D
    Sunday 17 August 2025
    Kdan Mobile Software partners with Japanese AI search startup for agent ecosystem
    Kdan Mobile Software (KDAN) has formed a strategic partnership with Japanese AI search engine startup Felo, with integrated technologies expected to debut in the fourth quarter of 2025. The companies will also collaborate on a joint sales plan targeting the AI agent market
    Sunday 17 August 2025
    Applied Materials faces lawsuit from smaller Chinese rival
    Chinese semiconductor equipment makers are increasingly taking the offensive in protecting their technology and intellectual property. Beijing E-Town Semiconductor Technology has sued US chipmaking equipment leader Applied Materials in the Beijing Intellectual Property Court, alleging the illegal acquisition and use of its core trade secrets, and is seeking CNY99.99 million (US$13.9 million) in damages
    Saturday 16 August 2025
    China breaks neutral atom quantum record, showcasing AI’s role in next-gen computing
    The quantum research team at the University of Science and Technology of China (USTC) has set a new world record. Academic administrator Jianwei Pan and Professor Chao-Yang Lu from USTC collaborated with the Shanghai Research Center for Quantum Sciences and researcher Han-Sen Zhong's team from Shanghai AI Laboratory. Using artificial intelligence (AI) technology, they successfully constructed defect-free two-dimensional (2D) and three-dimensional (3D) atomic arrays consisting of 2024 atoms within 60 milliseconds, breaking the global record for neutral atom quantum systems
    Saturday 16 August 2025
    SK Hynix expands EUV in 1c DRAM, launches faster low-power chips for AI PCs

    SK Hynix is stepping up its use of extreme ultraviolet (EUV) lithography in next-generation DRAM, increasing the number of EUV layers in its upcoming sixth-generation 10nm-class (1c) products to more than five. The plan was revealed at the Next Generation Lithography + Patterning Academic Conference in Suwon, South Korea

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    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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