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Liquid and air cooling solutions for AI servers

Kaylee Chiu
Kaylee Chiu
As air cooling grew insufficient for the heat dissipation of datacenters when running AI applications, L2A and L2L cooling methods are likely to see rising penetration to datacenters in the upcoming years.
Abstract

Based on DIGITIMES Research's observations, the rapid increases in high-end AI servers' computing power and energy consumption are driving leaping advances in cooling technologies and accelerating their time-to-market.

On top of that, the widespread popularity of generative AI starting in 2023 is spurring even stronger demand for higher computing power. To keep up with the demand, processors come with higher and higher thermal design power (TDP), which has exceeded the limit of traditional air cooling solutions.

DIGITIMES Research believes air-assisted liquid cooling solutions have more compelling advantages in the short term as they do not require large changes to the server design and datacenter infrastructure and their costs are significantly lower compared to pure liquid cooling solutions. These advantages will make air-assisted liquid cooling solutions a top choice for datacenter operators in the next three years.

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Published: April 30, 2024

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