DIGITIMES observes that fan-out panel-level package (FOPLP) has recently emerged as the next promising advanced packaging technology, following chip-on-wafer-on-substrate (CoWoS) and fan-out wafer-level package (FOWLP).
FOPLP's primary advantage lies in its use of square glass substrates instead of silicon wafers, reducing material waste and making it particularly suitable for applications with larger die areas, such as AI GPUs and application-specific integrated circuits (ASICs). However, due to the high technical barriers to producing high performance computing (HPC) chips, FOPLP is currently primarily focused on applications such as power management ICs (PMICs).
In addition to OSAT (outsourced semiconductor assembly and testing) companies, panel manufacturers such as Innolux and PCB manufacturers such as Unimicron are also actively investing in FOPLP. TSMC, the global semiconductor foundry leader, announced in 2024 its intention to invest in FOPLP, raising concerns among other companies about potential market fluctuations.
