Both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) saw losses from their 12-inch wafer fabs in China during the first half of 2019, while fellow...
China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...
Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Specialty DRAM and flash memory maker Winbond Electronics has seen its 12-inch fab run at full capacity starting July, thanks to the arrival of new orders and seasonal factors.
Pure-play foundry United Microelectronics (UMC) expects to post a 2-4% shipment increase sequentially in the third quarter of 2019, with a 1% rise in wafer ASPs.
Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility...
Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...
Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...
Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders...
Silicon wafer suppliers have seen 12-inch wafer demand plummet recently, due mainly to weak demand coming from the memory chip sector, according to industry sources. Prices for 12-inch...
Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
