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NEWS TAGGED 12-INCH
Monday 28 October 2019
Winbond posts profit growth in 3Q19
Specialty DRAM and flash memory maker Winbond Electronics has announced net profit increased 27.9% sequentially to NT$591 million (US$19.3 million) in the third quarter of 2019. EPS...
Thursday 24 October 2019
TSMC to accelerate 3nm fab construction
TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according...
Tuesday 15 October 2019
Powerchip eyeing return to Taiwan stock market
Powerchip Technology, in line with its corporate restructuring, has transferred all its fab and business assets to its 8-inch foundry subsidiary Powerchip Semiconductor Manufacturing...
Wednesday 25 September 2019
More 12-inch wafer fabs come online in China
China-based foundries including Hua Hong Semiconductor, CanSemi Technology, and memory startup ChangXin Memory Technologies (CXMT) have recently started operating their new 12-inch...
Monday 23 September 2019
TSMC to volume produce 5nm chips as early as March 2020
TSMC is expected to move its more advanced 5nm process technology to volume production as early as March, according to industry sources.
Monday 23 September 2019
Taiwan memory chipmakers to see sales peak in 3Q19
DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial...
Friday 20 September 2019
Winbond launches LPDDR4X memory
Winbond Electronics has announced its new LPDDR4X memory series designed for the emerging AI and 5G applications, such as ADAS, smart speakers, 8K TVs, 5G mobile phones and security...
Tuesday 10 September 2019
Highlights of the day: China DRAM maker moves in equipment at 12-inch fab
China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM...
Tuesday 10 September 2019
DRAM startup CXMT gearing up for production
China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has kicked off 12-inch fab equipment move-in in the third quarter, aiming to start commercial runs...
Monday 9 September 2019
Macronix, Winbond August revenues increase
Macronix International and Winbond Electronics have reported sequential increases in August consolidated revenues of 24.9% and 3.1%, respectively.
Monday 2 September 2019
TSMC, UMC see China-based fabs operate in the red in 1H19
Both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) saw losses from their 12-inch wafer fabs in China during the first half of 2019, while fellow...
Thursday 29 August 2019
Tsinghua Unigroup to set up DRAM operations HQ in Chongqing
China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...
Monday 26 August 2019
Memory backend firms see bright revenue prospect for 2H19
Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
Thursday 15 August 2019
SMIC to move FinFET process to volume production by year-end 2019
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...