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NEWS TAGGED 12-INCH
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Friday 15 September 2017
Marketech seeing orders swell, says report
Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$13.6 billion (US$452 million), according to a recent Chinese-language Economic Daily News...
Thursday 14 September 2017
Gudeng obtains FOUP orders from China 12-inch foundries
Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics...
Wednesday 13 September 2017
China to enhance local memory industry development
The China high-end IC Alliance (CHICA), which was set up by China's National Semiconductor Industry Investment Fund (known as the Big Fund) earlier in 2017, is looking to add another...
Wednesday 13 September 2017
TSMC starts equipment move-in at Nanjing plant
TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.
Thursday 7 September 2017
Two former Micron Taiwan employees indicted for alleged trade secrets theft
Two former employees of Micron Memory Taiwan (formerly Rexchip Electronics) have been indicted on charges of stealing trade secrets, according to prosecutors.
Wednesday 6 September 2017
Winbond to set up new fab in southern Taiwan
Taiwan's Ministry of Science and Technology (MOST) has approved specialty DRAM and flash maker Winbond Electronics' plan to set up a new fab at the Kaohsiung Science Park (KSP), southern...
Monday 4 September 2017
Digitimes Research: Taiwan top-3 foundries combined revenues to rise 13% in 3Q17
Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are...
Wednesday 30 August 2017
Samsung seeking long-term supply contracts with wafer firms
Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...
Wednesday 30 August 2017
GigaDevice draws investment from China state-backed fund
China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Wednesday 23 August 2017
Winbond announces equipment purchases
Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...
Friday 18 August 2017
Wafer Works expects wafer prices to continue rising on strong demand
Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.
Wednesday 16 August 2017
HiSilicon among top-5 customers of TSMC
With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's (TSMC) top-5 customers, according...
Tuesday 15 August 2017
SPIL to invest US$25 million in China
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research