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NEWS TAGGED 12-INCH
Monday 12 April 2010
PSC said to allocate more 12-inch capacity to produce DRAM for Elpida
Powerchip Semiconductor Corporation (PSC) has entered into a new agreement with Elpida Memory, under which PSC is allowed to source 24,000 wafer starts a month from their DRAM joint-venture...
Tuesday 30 March 2010
ProMOS to announce sale of 12-inch fab to Macronix in early April, say sources
ProMOS Technologies is set to announce the sale of a 12-inch wafer fab to Macronix International Company (MXIC) in early April, according to industry sources. The income from the...
Tuesday 23 March 2010
Semiconductor material distributor Topco predicts 30% revenue growth in 2010
Topco Scientific, a major distributor for blank wafer maker Shin-Etsu Handotai (SEH), has forecast revenues for 2010 will grow 30% on year. The semiconductor material distributor...
Tuesday 23 March 2010
Taiwan players may get green light for 12-inch fabs in China by 2012, says TSMC chairman
Taiwan-based semiconductor companies may be allowed to operate 12-inch fabs in China within two years, according to Morris Chang, chairman and CEO of Taiwan Semiconductor Manufacturing...
Monday 22 March 2010
12-inch wafer prices to rise 10-20% in 2Q10
Foundry chipmakers including Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have been informed by their upstream suppliers that average...
Friday 5 March 2010
UMC to step up hiring for 12-inch fab expansion
United Microelectronics Corporation (UMC) has recently announced plans to add a total of 1,000 engineers for its Fab 12A, a 12-inch wafer fab located at the Southern Taiwan Science...
Thursday 4 March 2010
Nanya to ramp 12-inch output to 50,000 wafers by year-end 2010
Nanya Technology plans to ramp up wafer starts at its 12-inch fab from the current 30,000 units to 50,000 units by year-end 2010, according to Jih Lien, president of Taiwan's largest...
Wednesday 3 March 2010
BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
Tuesday 2 March 2010
Prices of 8- and 12-inch wafers to rise in 2Q10, says paper
Major blank wafer suppliers including Shin-Etsu Handotai (SEH), Sumitomo Mitsubishi Silicon Corporation (Sumco) and MEMC Electronic Materials have all raised their quotes for the...
Monday 1 March 2010
ProMOS set to ink deal to sell 12-inch fab
DRAM maker ProMOS Technologies has recently made the decision to sell its 12-inch (300mm) wafer fab located at the Hsinchu Science Park (HSP) to mask ROM and NOR flash maker Macronix...
Wednesday 24 February 2010
Foundries to see 12-inch wafer supply exceed demand in 2012
With major foundry chipmakers gearing up for capacity expansions at their 12-inch (300mm) facilities, Nobunaga Chai, an analyst at Digitimes Research, has forecast worldwide 12-inch...
Wednesday 10 February 2010
12-inch wafers to be replaced by 18-inch in 2015, says Samsung senior VP
Eighteen-inch wafers will replace 12-inch as the mainstream in 2015, according to Joo-Tai Moon, senior vice president of Samsung Electronics. Moon also noted that Asia is the fastest...
Thursday 4 February 2010
TSMC and UMC expansion projects may result in overcapacity for 12-inch wafers, say sources
With both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) announcing plans to hike their capex budgets for 2010 to expand 12-inch wafer...
Friday 22 January 2010
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Monday 18 January 2010
Kinik obtains certification from TSMC for DDs used in 12-inch wafer CMP
Taiwan-based Kinik has secured certification from Taiwan Semiconductor Manufacturing Company (TSMC) for diamond disks (DDs) used in CMP (chemical-mechanical polishing) pad conditioning...