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NEWS TAGGED 2024
Thursday 20 February 2025
DeepSeek R1 sparks surge in China's Nvidia H GPU demand
The Chinese computing power market has experienced significant growth following the debut of DeepSeek R1. According to market sources, the end of the Lunar New Year holidays has increased...
Thursday 20 February 2025
Tron Future Tech leads Taiwan's advancement in drone defense and satellite innovation
The Taipei Computer Association has announced the winners of the 2024 "Outstanding Information Talent Award," with Tron Future Tech receiving recognition in the technological innovation...
Thursday 20 February 2025
China intensifies Mini LED TV strategy as South Korean experts seek OLED market solutions
A South Korean market research firm predicts that while the OLED TV market growth has stagnated, South Korean television manufacturers must leverage OLED technology to maintain their...
Wednesday 19 February 2025
Plaud.AI bets on AI recorder despite smartphone competition
San Francisco-based startup Plaud.AI has unveiled NotePin, touted as the world's smallest wearable AI recording capsule, following its smart recording card. Yet, with AI-powered smartphones...
Wednesday 19 February 2025
Young Optics shifts focus to CPO amid declining micro-projection, 3D printing revenue
Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Wednesday 19 February 2025
CIRC wins major orders for military drones from Taiwanese government
Coretronic Intelligent Robotics Corporation (CIRC), a subsidiary of the Coretronic Group, is actively participating in government procurement efforts and has secured substantial contracts...
Wednesday 19 February 2025
Nuvoton readies Microsoft co-developed BMC chip for mass production in 2025
Nuvoton, a microcontroller (MCU) provider, is emerging stronger from inventory corrections. Driven by recent pre-shipment demand from notebook/PC clients and continued adjustments...
Wednesday 19 February 2025
Packaging firm Xintec cautious about 1H25 prospects
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Wednesday 19 February 2025
Global silicon wafer shipments and revenue start to recover in late 2024
In the latter half of 2024, global demand for silicon wafers began to rebound from the industry's downturn experienced in 2023, as reported by the SEMI Silicon Manufacturers Group...
Wednesday 19 February 2025
China's subsidy boosts flat-screen TV sales, while chipmakers face mixed demand
China recently unveiled a series of subsidy policies targeting consumer electronics and home appliances to stimulate domestic consumption. Beyond the central government's efforts,...
Wednesday 19 February 2025
Hua Hong moves to advanced nodes following intensified legacy node competition
Amid intensifying competition in the mature-node segment, Hua Hong Semiconductor is pivoting toward higher-value process technologies. The company posted a fourth quarter of 2024...
Wednesday 19 February 2025
HP to acquire parts of Humane, Ai Pin startup from ex-Apple managers, for US$116 Million
HP will acquire assets from Humane Inc., the maker of the wearable Ai Pin introduced in late 2023, for US$116 million.
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
Wednesday 19 February 2025
Coretronic raises capex target for 2025
Coretronic, a manufacturer of LED backlight units (BLU), has raised its capital expenditure (capex) target to approximately NT$1.5 billion (approx. US$45.86 million) in 2025, up from...
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...