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    Trending
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    TSMC to double CoWoS capacity in 2025; Nvidia will use 60%
    Nov 21, 19:51
    Drone developer Thunder Tiger eyes strategic tie with NextVision
    Nov 21, 19:41
    HBM memory supply to scale in 2025
    Nov 21, 19:19
    China solar energy market remains plagued by low prices
    Nov 21, 19:16
    Despite start of new AI server shipments, server ODMs see gross margins fall
    Nov 21, 19:07
    Server component providers welcome new era with Nvidia GB200 mass production
    Nov 21, 19:02
    PCB and CCL firms gearing up for AI server boom
    Nov 21, 18:53
    GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed
    Nov 21, 18:50
    First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble
    Nov 21, 18:42
    NEWS TAGGED 3D PACKAGING
    Friday 6 January 2023
    Japanese manufacturers seize the opportunities of back-end processes
    Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...
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    Holtek
    BIZ FOCUS
    Nov 21, 09:56
    SK Hynix starts mass production of world's first 321-high NAND
    Thursday 21 November 2024
    Simmunome: Revolutionizing drug development with tech bio innovation
    Wednesday 20 November 2024
    VitalTracer's path to innovation: Revolutionizing remote patient monitoring
    Tuesday 19 November 2024
    From Canada to Asia: PragmaClin's mission to improve Parkinson's Disease diagnosis and care
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research