While the media is still buzzing about Huawei joining hands with Semiconductor Manufacturing International (SMIC) to manufacture advanced process 7nm and even 5nm chips, on the same...
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...
South Korean tech giant Samsung Electronics has received US$6.4 billion of US CHIPS Act direct funding and disclosed that it will increase its investments to US$40 billion to set...
Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation...
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Intel has welcomed the opening of Fab 9, a cutting-edge plant in Rio Rancho, New Mexico, a milestone in the company's production of 3D advanced packaging technology on a large scal...
Backend house Powertech Technology (PTI) expects to increase its 2024 capex to more than NT$10 billion (US$321 million), up from NT$7-8 billion in 2023, as it eyes growth opportunities...
With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
