Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in semiconductor packaging applications through the correction of printing variations. The technology addresses specific challenges in advanced packaging processes, including those used in AI semiconductor production.
With semiconductor miniaturization reaching physical limits in two-dimensional designs, the industry has increasingly moved toward three-dimensional (3D) stacking. Traditional methods like spin coating face limitations with 3D packaging requirements such as selective application and thickness variation, leading manufacturers to seek alternative approaches.
The company's ELP04 device uses NeuralJet technology for single-drop control of ink placement. According to Elephantech, the system produces coatings with surface roughness (Ra) of 0.8 nanometers and allows film thickness control from sub-micrometer to tens of micrometers. These specifications enable the targeted application of bonding materials at various thicknesses.
Additionally, Elephantech has released the ELP04-PILOT, a compact inkjet system for advanced packaging processes. The system is designed to support materials development and process optimization, with potential applications in silicon photonics and heterogeneous material coatings.
"This technology represents a significant development in semiconductor manufacturing," stated the company. "The improved efficiency and precision could expand options for AI semiconductor production and advanced packaging techniques."
The technology's applications include high-heat-resistant adhesive coatings on wafers and bonding of heterogeneous materials such as glass and silicon. The system provides thickness control, selective patterning, and coating capabilities on uneven surfaces for 3D packaging applications.
The development reflects ongoing industry efforts to enhance semiconductor production efficiency while reducing environmental impact. The NeuralJet technology aims to address current challenges in semiconductor packaging as designs continue to evolve.
