News tagged efficiency at DIGITIMES

NEWS TAGGED EFFICIENCY

Friday 5 June 2026

Qualcomm says Wi-Fi 8 prioritizes reliability over speed

Qualcomm recently outlined its vision for Wi-Fi 8, saying the next-generation standard is designed to improve overall reliability, lower latency, and expand coverage. The company said...

Friday 5 June 2026

Foxconn says Nvidia's Vera Rubin AI products remain on track for 2026 shipment

Foxconn and Foxconn Industrial Internet (FII) said at Computex that production of Nvidia's next-generation AI products is progressing smoothly, with shipments expected before the end...

Thursday 4 June 2026

BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display...

Wednesday 3 June 2026

Delta Electronics bets on microgrids in push for AI-powered energy management

The AI arms race is shaping up to be much more than a competition for computing power, with factors such as power supply, grid resilience, and carbon credits all playing a part in...

Tuesday 2 June 2026

Micron unveils AI memory and storage roadmap at COMPUTEX 2026

Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor...

Tuesday 2 June 2026

AI Data Center enters gigawatt scale; Power Architecture Emerges as Competitive Edge

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this...

Monday 1 June 2026

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

LITEON Technology will participate in COMPUTEX 2026, showcasing its AI infrastructure from cloud to edge and 5G. By connecting AI-RAN, intelligent surveillance, and smart...

Monday 1 June 2026

Flexium targets higher-value products and AI applications as turnaround expected in second half of 2026

Flexium Interconnect held its 2026 annual shareholders meeting on May 28 and outlined a strategic shift toward technology upgrades, higher-value products and improved operational efficiency...

Monday 1 June 2026

E Ink sees AI power crunch driving city, outdoor growth

E Ink Holdings held its annual shareholders' meeting on May 27, 2026, and passed all proposals. Chairman Johnson Lee said the global tech industry is rapidly entering a new stage in...

Monday 1 June 2026

Column: As token costs collapse, AI infrastructure splits into five layers

Falling inference prices and tightening data regulations are pushing AI compute beyond the hyperscale data center — reshaping infrastructure decisions for enterprises, governments,...

Friday 29 May 2026

Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...

Friday 29 May 2026

India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology

C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development...

Thursday 28 May 2026

Huawei Tau Law series 3: Global chip experts split over China's post-Moore push

Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...

Thursday 28 May 2026

China Airlines rides Taiwan's AI boom to record cargo profits

China Airlines said demand tied to artificial intelligence (AI) infrastructure and semiconductor shipments is helping fuel a strong rebound...

Wednesday 27 May 2026

Humanoid robot mass production hits a thermal wall

As humanoid robots move closer to mass production, thermal management is emerging as a critical bottleneck. Component efficiency, cramped joint architectures, and limited heat-dissipation...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook