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Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...

Friday 18 September 2026
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance...
Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

Thursday 10 September 2026
Firmus, OpenAI strike compute deal for Malaysia AI factories
Firmus and OpenAI have announced a multi-year strategic partnership that will add dedicated AI compute capacity in Malaysia, underscoring how Asia-Pacific is becoming central to global...
Thursday 10 September 2026
Three open source foundations share one stage in Shanghai
As AI applications move from the lab to large-scale deployment, China's open source ecosystem is increasingly focused on how to connect once-siloed technology layers to improve computing...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
Tuesday 8 September 2026
CIOE 2026: FIT wins Amphenol patent license, expands AI interconnect push
Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The...
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Monday 7 September 2026
Eaton expands AI data center stack from grid to chip
As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...