CONNECT WITH US
NEWS TAGGED EFFICIENCY
Wednesday 14 October 2026
ASE expands PowerSiP platform to improve AI data center power efficiency
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Wednesday 14 October 2026
Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs
Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
Wednesday 14 October 2026
Largan chairman casts doubt on Micro LED links for AI data centers
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...
Wednesday 14 October 2026
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
Wednesday 14 October 2026
AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
Wednesday 14 October 2026
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
Wednesday 14 October 2026
CyberTAN sells Hsinchu site in US$68B deal to fund strategy shift
CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may...
Wednesday 14 October 2026
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...
Wednesday 14 October 2026
Linde LienHwa links HaaS ecosystem to drive industrial decarbonization
Industrial gas supplier Linde LienHwa is expanding its industrial decarbonization applications, with oxygen-enriched combustion technology adopted by Taiwan Cement, Walsin Lihwa, Jin...
Tuesday 13 October 2026
Hong Kong and Japan expand air cargo capacity through multimodal logistics
Hong Kong International Airport and Japan Airlines (JAL) Group are expanding sea-air and rail-air logistics networks to increase passenger and cargo flows, address transport bottlenecks...
Tuesday 13 October 2026
Toyota rewires China JV structure as GAC takes control of FAW Toyota stake
As the push toward smarter vehicle systems and full electrification intensifies alongside China's strengthening position in the EV market, these trends are increasingly prompting overseas...
Monday 12 October 2026
AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
Monday 12 October 2026
LG Display unveils maskless OLED technology, targeting more efficient IT displays
LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...
Thursday 8 October 2026
Infineon completes acquisition of C2i to expand AI data center power capabilities
Infineon has finished acquiring India-based C2i Semiconductors, a maker of software-defined multiphase controllers and smart power stages used in AI data centers. The acquisition indicates...
Wednesday 7 October 2026
DIGITIMES Insight: HBM expansion raises the bar for memory offload
The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...