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Friday 19 June 2026
Cornelis-powered Lynx supercomputer enters service at LLNL, expanding NNSA computing capacity

Cornelis Networks has announced the successful deployment of the Lynx supercomputing cluster at the US Department of Energy's Lawrence...

Friday 19 June 2026
Samsung Foundry to make Claros power-management chips for AI data centers

Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup,...

Friday 19 June 2026
Kioxia keeps NAND capex in check as AI inference reshapes SSD demand

Kioxia, one of the world's major NAND flash memory suppliers, is prioritizing long-term agreements (LTAs), BiCS migration, and domestic...

Thursday 18 June 2026
SiC cuts AI data center costs; 5% efficiency gain saves US$5 billion
Power is now compute, and it is becoming a major driver of AI data center build costs. Renesas technical director Mu-Sen Lin said traditional data centers rely on low-voltage AC (LVAC),...
Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Nuvoton partners Qualcomm to advance tethered XR glass SoC business

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered...

Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Thursday 18 June 2026
Research Insight: Fukuta deepens EV moat with hub motors and thin silicon steel

As the global electric vehicle (EV) market enters a correction phase, automakers are demanding more from both cost and efficiency....

Wednesday 17 June 2026
PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate...
Friday 12 June 2026
Hanwha Qcells expands from US solar manufacturing into lunar testing, highlighting supply-chain and technology implications

Hanwha Qcells is moving its next-generation solar technology from terrestrial markets to a lunar test platform, while also bringing...

Friday 12 June 2026
Cadence deepens Intel Foundry partnership on next-generation chip design
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The...
Wednesday 10 June 2026
WD pushes toward 100TB hard drives as AI storage demand surges
WD is preparing for a global wave of AI data growth by prioritizing hard drives with higher capacity, faster performance, and lower power consumption. The company says the shift reflects...
Wednesday 10 June 2026
Grab eyes Taiwan as first move beyond SEA market
Grab is preparing to enter Taiwan, and once its acquisition of foodpanda is approved by regulators, Taiwan will become the company's first market outside Southeast Asia. Grab's Operating...
Tuesday 9 June 2026
Onsemi launches Elite Pairing Studio to simplify power design
Onsemi has introduced an online design tool to help engineers match SiC MOSFETs and gate drivers more quickly. The company said the platform could reduce early-stage trial-and-error...
Monday 8 June 2026
China introduces energy standards to curb growing EV size and weight
China's electric vehicles have become larger, heavier, and increasingly luxurious over the past decade. Now, regulators are signaling that the industry's era of unchecked expansion...