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Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

Thursday 10 September 2026
Firmus, OpenAI strike compute deal for Malaysia AI factories
Firmus and OpenAI have announced a multi-year strategic partnership that will add dedicated AI compute capacity in Malaysia, underscoring how Asia-Pacific is becoming central to global...
Thursday 10 September 2026
Three open source foundations share one stage in Shanghai
As AI applications move from the lab to large-scale deployment, China's open source ecosystem is increasingly focused on how to connect once-siloed technology layers to improve computing...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
Tuesday 8 September 2026
CIOE 2026: FIT wins Amphenol patent license, expands AI interconnect push
Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The...
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Monday 7 September 2026
Eaton expands AI data center stack from grid to chip
As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Friday 4 September 2026
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
Thursday 3 September 2026
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

Thursday 27 August 2026
Tesla doubles down on custom AI chips as Musk claims AI5 can beat NVIDIA on efficiency and cost
Tesla CEO Elon Musk recently said the company's upcoming AI5 inference chip could deliver two to three times the performance per watt of Nvidia products when deployed in autonomous...
Wednesday 26 August 2026
OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
Tuesday 25 August 2026
SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...