Adam Lin, chairman of optical lens and optoelectronics maker Largan Precision, emphasized the company's strategic focus on avoiding orders with low profit margins that could reduce...
TienPin United Enterprise has been benefiting from a rapid surge in the artificial intelligence (AI) server liquid-cooling cleaning business since the second half of 2025, with its...
South Korean OLED materials developer Lordin plans to seek a technology-special listing in the first half of 2027, with a US$25 million fundraising round targeted for completion in...
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...
Chunghwa Telecom and Nokia signed a memorandum of understanding at the 2026 Mobile World Congress to deepen their strategic collaboration on AI-driven network optimisation, 5G-Advanced...
Keysight Technologies and MediaTek said they have jointly developed an AI-driven radio access network technology aimed at improving uplink performance and will debut a validated prototype...
As demand for computing power from AI large language models (LLMs) continues to surge, power density in data centers is rising in tandem, bringing the conversion losses of traditional...
ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC,...
Ablecom announced its ABLERACK AI server rack solution, positioning it in the L11 domain and offering an integrated design for manufacturing services that combine energy efficiency,...
Huawei and ByteDance have jointly unveiled a next-generation AI acceleration chip based on resistive random-access memory (RRAM), developed with Tsinghua University and other Beijing...
Rohm has reached an agreement to integrate its internal development and manufacturing capabilities for gallium nitride (GaN) power devices with process technology from Taiwan Semiconductor...
As AI-driven demand continues to lift global semiconductor output, TSMC is accelerating the localization of electroplating additives used in advanced packaging to secure a stable supply...
Leading global semiconductor foundry, United Microelectronics Corporation (UMC), has announced on February 25, 2026, a significant restructuring of its executive leadership structu...
ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...
Taiwan Mobile has said it will send a delegation led by President Jamie Lin to MWC Barcelona 2026 in early March, where it plans to sign a new memorandum of understanding with Nokia...