Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase...

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

As AI workloads reshape data center design, performance is no longer defined solely by computing power. Thermal management has emerged...