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    Google and Meta help drive AI glasses shipments to 17.5 million units in 2026
    6h 41min ago
    SK may pause SK Siltron sale as AI strategy gains priority over financial restructuring
    6h 41min ago
    AI cooling demand keeps booming, lifting suppliers’ outlook through 2029
    6h 41min ago
    Nvidia, Infineon and GIGABYTE back supply chain cooperation to ease AI power bottlenecks
    7h 0min ago
    Micron, Samsung and SK Hynix join Anthropic in a supply chain shift
    7h 0min ago
    Pegatron expands physical AI push with Nvidia partnership and second-gen robot dog
    7h 1min ago
    NEWS TAGGED EFFICIENCY
    Tuesday 2 June 2026
    Micron unveils AI memory and storage roadmap at COMPUTEX 2026
    Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor...
    Tuesday 2 June 2026
    AI Data Center enters gigawatt scale; Power Architecture Emerges as Competitive Edge

    As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this...

    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

    LITEON Technology will participate in COMPUTEX 2026, showcasing its AI infrastructure from cloud to edge and 5G. By connecting AI-RAN, intelligent surveillance, and smart...

    Monday 1 June 2026
    Flexium targets higher-value products and AI applications as turnaround expected in second half of 2026
    Flexium Interconnect held its 2026 annual shareholders meeting on May 28 and outlined a strategic shift toward technology upgrades, higher-value products and improved operational efficiency...
    Monday 1 June 2026
    E Ink sees AI power crunch driving city, outdoor growth
    E Ink Holdings held its annual shareholders' meeting on May 27, 2026, and passed all proposals. Chairman Johnson Lee said the global tech industry is rapidly entering a new stage in...
    Monday 1 June 2026
    Column: As token costs collapse, AI infrastructure splits into five layers
    Falling inference prices and tightening data regulations are pushing AI compute beyond the hyperscale data center — reshaping infrastructure decisions for enterprises, governments,...
    Friday 29 May 2026
    Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
    Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
    Friday 29 May 2026
    India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology
    C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development...
    Thursday 28 May 2026
    Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
    Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
    Thursday 28 May 2026
    China Airlines rides Taiwan's AI boom to record cargo profits

    China Airlines said demand tied to artificial intelligence (AI) infrastructure and semiconductor shipments is helping fuel a strong rebound...

    Wednesday 27 May 2026
    Humanoid robot mass production hits a thermal wall
    As humanoid robots move closer to mass production, thermal management is emerging as a critical bottleneck. Component efficiency, cramped joint architectures, and limited heat-dissipation...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Saturday 23 May 2026
    Tech Forum 2026: Autonomous driving enters commercial validation era, shifting competition to algorithms, chips, and data
    As Computex approaches, DIGITIMES hosted a forum where analyst Mark Yee argued that Physical AI is driving autonomous driving into full commercial validation, with implications for...
    Friday 22 May 2026
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook