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    NEWS TAGGED EFFICIENCY
    Friday 29 May 2026
    Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
    Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
    Friday 29 May 2026
    India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology
    C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development...
    Thursday 28 May 2026
    Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
    Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
    Thursday 28 May 2026
    China Airlines rides Taiwan's AI boom to record cargo profits

    China Airlines said demand tied to artificial intelligence (AI) infrastructure and semiconductor shipments is helping fuel a strong rebound...

    Wednesday 27 May 2026
    Humanoid robot mass production hits a thermal wall
    As humanoid robots move closer to mass production, thermal management is emerging as a critical bottleneck. Component efficiency, cramped joint architectures, and limited heat-dissipation...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Saturday 23 May 2026
    Tech Forum 2026: Autonomous driving enters commercial validation era, shifting competition to algorithms, chips, and data
    As Computex approaches, DIGITIMES hosted a forum where analyst Mark Yee argued that Physical AI is driving autonomous driving into full commercial validation, with implications for...
    Friday 22 May 2026
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
    Friday 22 May 2026
    MEAN WELL Showcases Advanced Power Supply Solutions at COMPUTEX 2026

    As global electricity demand accelerates - driven by rapid AI computing growth, rising corporate decarbonization commitments, and increasing focus on grid stability -...

    Friday 22 May 2026
    Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026
    At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for...
    Thursday 21 May 2026
    Exclusive: TOPCon faces funding cuts while HJT and BC receive government support
    As China's solar market enters a downfall, market sources indicate that China's central government is reshaping the industry landscape through an aggressive dual-track strategy. On...
    Wednesday 20 May 2026
    Tech Forum 2026: Physical AI poised to accelerate autonomous driving and robotics, analysts say
    Physical AI is set to reshape autonomous driving and robotics. At the DIGITIMES Tech Forum 2026, held ahead of COMPUTEX 2026, analysts said advances in perception, decision-making,...
    Wednesday 20 May 2026
    Gaia Motors rolls out Rapide 3 electric three-wheeler network across Taiwan
    Gaia Motors has launched a nationwide channel rollout in Taiwan for its Rapide 3 electric three-wheeler, expanding the vehicle's availability from enterprise fleets to broader commercial...
    Monday 18 May 2026
    Edge-cloud shift opens new growth runway for Taiwan's chip suppliers
    As generative AI proliferates across end devices, a distributed edge-cloud architecture is taking shape — shifting inference workloads from the cloud to local hardware to reduce...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook