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    China moves to rein in booming energy storage and lithium battery overcapacity
    8h 23min ago
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    8h 24min ago
    Apple's iPhone Duo may lift foldables, but Taiwanese suppliers seek new growth
    8h 24min ago
    How Huawei, Xiaomi and Apple diverge in foldable phones
    8h 24min ago
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    8h 24min ago
    NEWS TAGGED EFFICIENCY
    Thursday 10 September 2026
    Firmus, OpenAI strike compute deal for Malaysia AI factories
    Firmus and OpenAI have announced a multi-year strategic partnership that will add dedicated AI compute capacity in Malaysia, underscoring how Asia-Pacific is becoming central to global...
    Thursday 10 September 2026
    Three open source foundations share one stage in Shanghai
    As AI applications move from the lab to large-scale deployment, China's open source ecosystem is increasingly focused on how to connect once-siloed technology layers to improve computing...
    Wednesday 9 September 2026
    Arm expands push for agentic AI infrastructure with new Neoverse chip design
    Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
    Tuesday 8 September 2026
    FIT wins Amphenol patent license, expands AI interconnect push
    Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The...
    Monday 7 September 2026
    Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
    Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
    Monday 7 September 2026
    Eaton expands AI data center stack from grid to chip
    As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
    Saturday 5 September 2026
    Topco targets optical comms, cooling as copper gives way
    System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
    Friday 4 September 2026
    Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
    As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
    Thursday 3 September 2026
    CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

    Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

    Thursday 27 August 2026
    Tesla doubles down on custom AI chips as Musk claims AI5 can beat NVIDIA on efficiency and cost
    Tesla CEO Elon Musk recently said the company's upcoming AI5 inference chip could deliver two to three times the performance per watt of Nvidia products when deployed in autonomous...
    Wednesday 26 August 2026
    OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
    OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
    Tuesday 25 August 2026
    SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

    SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...

    Friday 21 August 2026
    Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

    At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

    Friday 21 August 2026
    Research Insight: 2028 key year for optical interconnects in AI racks
    Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    reportAIglasses