ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects...
As the high power density of AI data centers (AIDCs) becomes an increasingly pressing issue, industry experts are highlighting the importance of power management and power usage effectiveness...
Delta Electronics showcased its on-site solid oxide fuel cell (SOFC) power generation solution at Energy Taiwan 2026, alongside its first physical solid-state transformer (SST) pro...
Delta Electronics unveiled its prefabricated solid-state transformer (SST) DC power solution at Energy Taiwan 2026 on October 14, targeting power efficiency, deployment speed and supply...
Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...
Delta, a global leader in power management and smart green solutions, unveiled its comprehensive microgrid and power infrastructure solutions for AI factories and high-density computing...
Lite-On Technology is showcasing an 800 VDC power architecture, NVIDIA Vera Rubin-compatible power racks and integrated liquid-cooling systems at the 2026 Open Compute Project (OCP)...
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may...
