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Friday 2 October 2026
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
Friday 2 October 2026
FAW, GAC formalize partnership as Toyota's China joint ventures face possible overhaul
China's state-owned FAW and GAC's controlling shareholder, Guangzhou Automobile Industry Group, have signed a strategic cooperation framework that could reshape Toyota's long-standing...
Thursday 1 October 2026
ASE expands smart OSAT push with six university research partnerships
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Thursday 1 October 2026
Applied Materials and Kioxia team up on AI-era memory tech
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
Tuesday 29 September 2026
Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
Samsung Electronics' foundry business has reportedly raised yield on its 2-nanometer (2nm) SF2 process to nearly 60% and is now shifting engineering work toward power efficiency and...
Monday 28 September 2026
Beyond ASML: China rethinks EUV race with light-source strategy
China is trying to broaden the definition of the extreme ultraviolet (EUV) race. Rather than focusing only on building a domestic equivalent to ASML's lithography platform, Chinese...
Thursday 24 September 2026
FSP Debuts World's First 80 PLUS Ruby ATX PSU

As the global wave of artificial intelligence (AI) accelerates, the surge in large language model training and edge-side inference has driven an exponential demand for...

Wednesday 23 September 2026
Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning...
Wednesday 23 September 2026
Apple delays 20th-anniversary iPhone display upgrades
Apple has reportedly pushed back plans to add new display technologies to the iPhone model expected in 2027, which marks the product line's 20th anniversary. According to ET News,...
Wednesday 23 September 2026
Acbel targets Europe's fast-charging market with new high-power DC modules
Demand for faster EV charging is rising as markets move from slow AC systems to DC fast charging and ultra-fast networks. The expansion in Poland points to wider global implications...
Tuesday 22 September 2026
Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them

Europe intends to triple its data center capacity within five to seven years. On September 21, the European Commission set out how it...

Tuesday 22 September 2026
MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.
Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move...

Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...