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Thursday 14 November 2024
Kaori forms thermal tech subsidiary to capture AI cooling demand
Kaori Heat Treatment Co. approved the formation of a wholly-owned subsidiary focused on thermal solutions at an extraordinary shareholders' meeting on November 12, transferring its...
Wednesday 13 November 2024
SK Hynix's US subsidiary Solidigm introduces industry's first 122TB eSSD fit for AI applications
Solidigm, a U.S. subsidiary fully-owned by Korea's SK Hynix, and a leading provider of innovative NAND flash memory solutions, introduced today the 122TB (terabyte) Solidigm D5-P5336...
Monday 11 November 2024
HOLTEK diverse application charger and lithium battery management
Lithium batteries now form an integral part of modern-day living and can be seen in multiple applications such as power tools, vacuum cleaners, mobile devices, and electric bicycles...
Wednesday 6 November 2024
Hybrid energy islands emerge as promising renewable technology solution
Transitioning to net-zero emissions by 2050 presents a major challenge for Taiwan and many countries alike, demanding extensive changes to energy infrastructure, industrial practices,...
Monday 4 November 2024
Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Friday 1 November 2024
LG's transformation pays off, delivering record-high 3Q24 results on 3 core pillars
LG Electronics' strategic transformation efforts are paying off, as evidenced by its record-breaking third quarter 2024 performance, driven by three core pillars: operational efficiency,...
Thursday 31 October 2024
Ennostar leverages Micro LED for AI optical communication and short-range transmission
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Wednesday 30 October 2024
Samsung Galaxy 25 to adopt M13 material combination for OLED
Samsung Electronics is expected to launch its flagship Galaxy S25 series in early 2025. Reports indicate that Samsung Display (SDC) will supply OLED panels using a material combination...
Wednesday 30 October 2024
Server ODMs focus on leak-proof liquid cooling solutions, says DIGITIMES Research
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Monday 28 October 2024
Innolux leads with copper-acid electrolysis in green recycling push
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Friday 25 October 2024
Long-range, low-power wireless monitoring WiFi HaLow outdoor IP camera
BRICKCOM Communication Co., Ltd. today announced the launch of its groundbreaking WiFi HaLow outdoor network camera solution designed to address the growing demand for reliable and...
Monday 21 October 2024
Imec builds chiplet ecosystem for smart cars, uniting semiconductor, automotive giants
As the automotive industry advances toward electrification and greater electronic integration, a key challenge is that vehicle chips cannot be upgraded as quickly as those in the...
Monday 21 October 2024
Lite-On pivots to AI server solutions, targeting double-digit sales growth by 2025: An interview
Lite-On Technology has successfully transitioned into a solution provider, capitalizing on the growing demand for AI servers. The company's global strategy and focus on high-value...
Monday 21 October 2024
Applied's new RuCo combination stabilizes 2nm process yields for TSMC and Samsung
Applied Materials (Applied) has announced the use of a new material, ruthenium (Ru), in equipment designed to enhance efficiency in advanced semiconductor processes. This initiative...