CONNECT WITH US
NEWS TAGGED ABSOLICS
Friday 6 December 2024
US awards chip incentives to Absolics, Entegris for advanced chip technology and onshore materials development
On December 5, the US Department of Commerce finalized grants under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities, directing significant...
Thursday 21 November 2024
U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
Friday 24 May 2024
Absolics becomes first materials firm to get US CHIPS Act subsidy
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.