CyCraft announced an expansion of its Japan strategy at its CyCraft Day Japan partner summit, teaming with local cybersecurity providers, including NTT Security and Future Secure Wave,...
DeepSeek briefly released, then removed, a multimodal research paper that offers rare insight into its evolving AI strategy, drawing attention across the developer community.
PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
Taiwan is stepping up its global semiconductor leadership with a coordinated push into silicon photonics (SiPh) and advanced materials, aiming to meet surging demand for faster, more...
NeurIPS' new rule barring institutions on the US Treasury Department's OFAC entity list from submitting papers, reviewing, or editing risks fracturing global AI collaboration, excluding...
Taiwan has long leveraged its manufacturing strengths to carve out a place in the global supply chain. Now, it is going further. With research and development reach expanding overseas,...
Minister of the National Science and Technology Council (NSTC) Cheng-wen Wu has recently sparked a firestorm across Taiwan's academic community. His blunt critique of long-standing...
The rapid evolution of robots with stable gait and agile manipulation—spotlighted at CES 2026—signals that robots integrated into daily life are moving from vision to reality...
Once a low-cost commodity underpinning global computing, dynamic random-access memory (DRAM) has become a strategic chokepoint as AI-driven demand reshapes supply chains. With prices...
E-band wireless communication, operating between 71-76 GHz and 81-86 GHz, offers extremely high data throughput and ultra-low latency. Beyond its current use in automotive radar, next-generation...
The International Solid State Circuits Conference (ISSCC) will take place from February 15 to 19, 2026, in San Francisco, US, with MediaTek CEO Rick Tsai delivering the opening keynote...
China is advancing its use of artificial intelligence (AI), with a breakthrough from Zhejiang University (ZJU)'s College of Integrated Circuits drawing industry attention. The university...
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan...
