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Wednesday 2 October 2024
India launches government-led generative AI project for local languages
The Ministry of Science & Technology of India has announced the launch of BharatGen, a generative AI initiative focused on developing foundational models in language, speech,...
Wednesday 2 October 2024
iPhone 16 series faces fierce competition as Samsung and Xiaomi deliver counterpunches
Despite mixed reviews globally for Apple's iPhone 16 series, strong support from telecom companies, retail distributors, and e-commerce platforms has driven sales of the iPhone 16...
Wednesday 2 October 2024
Quanta expands AI solutions beyond healthcare with QOCA platform
Quanta Computer, after years of pioneering AI-powered smart healthcare solutions, is now exploring wider applications across various industries. Robe Yang, senior director at Quanta's...
Wednesday 2 October 2024
Samsung's Galaxy Tab S10 series features MediaTek chips for the first time
Samsung Electronics (Samsung) has revealed that its Galaxy Tab S10 series features the MediaTek Dimensity 9300+ chip, departing from its usual choice of Qualcomm or in-house application...
Wednesday 2 October 2024
Inventec AI chip IP development comes to fruition
Inventec has already seen clients start volume production for AI chips leveraging its intellectual property (IP), according to the Taiwan-based ODM.
Wednesday 2 October 2024
China to accelerate AI datacenter construction in 3 years
China has officially disclosed its current national computational capacity and progress for the first time. According to Zhiguo Zhao, director general of the Administration for Information...
Wednesday 2 October 2024
Foxconn to kick off shipments for new-gen AI servers in 4Q24
Hon Hai Technology Group (Foxconn) reaffirmed on October 1 that its next-generation AI servers will begin shipping in the fourth quarter of 2024, with production models on display...
Wednesday 2 October 2024
Cerebras IPO signals growing challenge to Nvidia's AI chip dominance
As the largest beneficiary of the generative AI surge, Nvidia's dominance has attracted a wave of challengers. The recent initial public offering (IPO) filing by Cerebras signals...
Tuesday 1 October 2024
SoftBank rises on possible $500 million investment in OpenAI
SoftBank Group Corp.'s stock rebounded, helped by the Japanese company's possible participation in an OpenAI funding round that may better position Masayoshi Son in a race over artificial...
Tuesday 1 October 2024
SiPh and glass substrates seen as new areas of focus for TSMC and Nvidia
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
Tuesday 1 October 2024
SK Hynix's debut at TSMC OIP forum showcases HBM3E, H200 breakthrough, boosts Nvidia partnership
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
Tuesday 1 October 2024
Taiwan's robotics approach: Prioritizing modular, intelligent, and collaborative solutions for niche markets over humanoids
At the 2024 World Robot Conference held in late August in Beijing, Chinese companies showcased numerous humanoid robots, reflecting their enthusiasm for futuristic robotics. In contrast,...
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Tuesday 1 October 2024
Peripheral chips to experience fast growth in 2025 due to AI server demand
Business opportunities for peripheral chips can only advance further when AI servers become more popularized. The industry believes that the first wave of growth may occur in 2025.
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research