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Tuesday 30 September 2025
South Korea's Rebellions raises US$250M from Arm and Samsung, valued at US$1.4B
South Korean AI semiconductor startup Rebellions has raised US$250 million in a Series C round, backed by Arm Holdings Plc, Samsung Ventures, and Pegatron's VC arm, accelerating its...
Saturday 27 September 2025
When LLMs outgrow the chip: Huawei's P/D separation redefines design choices
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture...
Thursday 25 September 2025
Alibaba stakes out AI chip ecosystem, setting up a clash with Huawei
Alibaba is steadily building a vertically integrated chip ecosystem that spans cloud computing, AI chip design, and advanced packaging. People's Daily recently revealed a...
Thursday 25 September 2025
Research Insight:TSMC unveils ‘Three Arrows’ plan to curb carbon footprint amid AI chip surge
As the global demand for AI chips skyrockets, a new challenge is emerging for the semiconductor industry: how to balance explosive growth with environmental responsibility. The production...
Sunday 21 September 2025
China's Cambricon taps into unprecedented boom in AI chips
Chinese AI chipmaker Cambricon Technologies is seizing what chairman and CEO Chen Tianshi describes as an "unprecedented opportunity" in intelligent computing. Surging domestic demand...
Friday 19 September 2025
Huawei Ascend 950 to feature in-house HBM in 2026, advancing China's AI memory independence
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend...
Friday 19 September 2025
Alibaba's T-Head AI chip rivals Nvidia H20, wins major China Unicom data center deal
Alibaba's chip design arm T-Head has introduced its latest AI accelerator, the PPU, positioning it as a rival to Nvidia's China-only H20 GPU. The processor has already been rolled...
Thursday 18 September 2025
Huawei charts 6-year Ascend AI chip roadmap, showcasing HBM advances and SuperNode scale
Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating...
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Saturday 13 September 2025
Beijing's chip advance, from equipment to AI, threatens Seoul's tech stronghold
South Korea's chipmakers are raising red flags as China accelerates in equipment, materials, components, and AI semiconductors. Analysts warn Beijing is no longer just closing the...
Friday 12 September 2025
Huawei, Cambricon AI chip production set to top one million units by 2026
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Thursday 11 September 2025
SEMICON Taiwan 2025: Tenstorrent's Jim Keller advocates for democratizing AI chip development with RISC-V
Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Wednesday 10 September 2025
AI chip demand drives future semiconductor growth trends
SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the...
Wednesday 10 September 2025
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...
Tuesday 9 September 2025
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...